Description
InventoryConfiguration
Max. Workpiece size mm ø200 Processing method Fully automatic X-axis Max. feed speed mm/s 1.0 - 1,000 Y-axis Positioning accuracy mm Within 0.003/210 Utilities Dimensions (WxDxH) mm 950 x 1,732 x 1,800 Weight kg Approx. 1,800OEM Model Description
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.Documents
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DISCO
DFL7340
Verified
CATEGORY
Scribing, Cutting, Dicing
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
15984
Wafer Sizes:
Unknown
Vintage:
Unknown
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DISCO
DFL7340
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
15984
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
InventoryConfiguration
Max. Workpiece size mm ø200 Processing method Fully automatic X-axis Max. feed speed mm/s 1.0 - 1,000 Y-axis Positioning accuracy mm Within 0.003/210 Utilities Dimensions (WxDxH) mm 950 x 1,732 x 1,800 Weight kg Approx. 1,800OEM Model Description
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.Documents
No documents