Description
Process: Saw Wafer Size: 4inch (Sapphire Glass) Main Controller: Hitachi HJ-4030-NOJSA LASER: HAMAMATSU Laser Type: SDE Laser Maximum Power: 2W Laser Wavelength: 1045nm Servo Drive: Panasonic x 6eaConfiguration
No ConfigurationOEM Model Description
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.Documents
No documents
DISCO
DFL7340
Verified
CATEGORY
Scribing, Cutting, Dicing
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
53894
Wafer Sizes:
Unknown
Vintage:
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View All
DISCO
DFL7340
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
53894
Wafer Sizes:
Unknown
Vintage:
2010
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Process: Saw Wafer Size: 4inch (Sapphire Glass) Main Controller: Hitachi HJ-4030-NOJSA LASER: HAMAMATSU Laser Type: SDE Laser Maximum Power: 2W Laser Wavelength: 1045nm Servo Drive: Panasonic x 6eaConfiguration
No ConfigurationOEM Model Description
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.Documents
No documents