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DISCO DFL7160
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    DISCO

    DFL7160

    Created: November 15, 2018

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    Last Verified: Over 60 days ago

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    Key Item Details

    Condition: As Is

    Product ID: 18639

    Wafer Sizes:

    Vintage: 2012

    Description

    WBL LASER SAW(DAF SAW)

    Configuration

    No Configuration

    OEM Model Description

    2002 300 mm-compatible Fully Automatic Laser Saw DFL7160 developed. Supports various applications, including full cut and DAF cut Φ300 mm Ablation DFL7160 is a fully-automatic laser saw for Φ300 mm wafers which uses a pulse laser to achieve non-thermal processing. This model has seen wide use in many applications such as GaAs full cut and DAF cut after DBG. Wafer contamination from laser processing particles can be prevented through installation of the HogoMax * coating/cleaning mechanism. *A water-soluble protective film that prevents laser processing particles from adhering to the wafer surface

    Other Information
    No Other Information Provided
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