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Model Precio CPU Main CPU Comm I/F GPIB SACC n/a Inker n/a Polisher n/a Chuck Type Hot (hot chuck but no temp controller) Temp.Ambient Chuck Ni OCR n/a Loader type TS1 Buffer Table Front Option - 1 USB no manipulators fully operational and onlineOEM Model Description
The Precio™ series is a fully automatic wafer-probing platform designed to meet the increasing demand for probing technology in the test process. With process miniaturization, higher device functionality, and package variety, the Precio™ series offers reliable solutions to a wide range of probing demands. It has a wafer size of 200/300mm and uses ball screw stage technology. The XY probing accuracy is ±1.8μm, and the Z probing accuracy is ±5.0μm, allowing for more reliable contacts and greater Z-axis control for soft contact. The probing force is 200/300kg (available as an option). The optical system used is ASU/BCU-Ⅱ, and the operation system is Windows+VME. Optimum temperature control during testing and increased parallel die testing are also achieved with the Precio™ prober series.Documents
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TEL / TOKYO ELECTRON
PRECIO
Verified
CATEGORY
Probers
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
18342
Wafer Sizes:
Unknown
Vintage:
2008
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TEL / TOKYO ELECTRON
PRECIO
Verified
CATEGORY
Probers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
18342
Wafer Sizes:
Unknown
Vintage:
2008
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Model Precio CPU Main CPU Comm I/F GPIB SACC n/a Inker n/a Polisher n/a Chuck Type Hot (hot chuck but no temp controller) Temp.Ambient Chuck Ni OCR n/a Loader type TS1 Buffer Table Front Option - 1 USB no manipulators fully operational and onlineOEM Model Description
The Precio™ series is a fully automatic wafer-probing platform designed to meet the increasing demand for probing technology in the test process. With process miniaturization, higher device functionality, and package variety, the Precio™ series offers reliable solutions to a wide range of probing demands. It has a wafer size of 200/300mm and uses ball screw stage technology. The XY probing accuracy is ±1.8μm, and the Z probing accuracy is ±5.0μm, allowing for more reliable contacts and greater Z-axis control for soft contact. The probing force is 200/300kg (available as an option). The optical system used is ASU/BCU-Ⅱ, and the operation system is Windows+VME. Optimum temperature control during testing and increased parallel die testing are also achieved with the Precio™ prober series.Documents
No documents