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TEL / TOKYO ELECTRON PRECIO
    Description
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    OEM Model Description
    The Precio™ series is a fully automatic wafer-probing platform designed to meet the increasing demand for probing technology in the test process. With process miniaturization, higher device functionality, and package variety, the Precio™ series offers reliable solutions to a wide range of probing demands. It has a wafer size of 200/300mm and uses ball screw stage technology. The XY probing accuracy is ±1.8μm, and the Z probing accuracy is ±5.0μm, allowing for more reliable contacts and greater Z-axis control for soft contact. The probing force is 200/300kg (available as an option). The optical system used is ASU/BCU-Ⅱ, and the operation system is Windows+VME. Optimum temperature control during testing and increased parallel die testing are also achieved with the Precio™ prober series.
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    TEL / TOKYO ELECTRON

    PRECIO

    verified-listing-icon

    Verified

    CATEGORY

    Probers
    Last Verified: Over 60 days ago
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    61844


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown

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    TEL / TOKYO ELECTRON PRECIO
    TEL / TOKYO ELECTRONPRECIOProbers
    Vintage: 0Condition: Used
    Last VerifiedToday

    TEL / TOKYO ELECTRON

    PRECIO

    verified-listing-icon

    Verified

    CATEGORY

    Probers
    Last Verified: Over 60 days ago
    listing-photo-504d9d11491f44e5af9b6f5ca954c6bd-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    61844


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The Precio™ series is a fully automatic wafer-probing platform designed to meet the increasing demand for probing technology in the test process. With process miniaturization, higher device functionality, and package variety, the Precio™ series offers reliable solutions to a wide range of probing demands. It has a wafer size of 200/300mm and uses ball screw stage technology. The XY probing accuracy is ±1.8μm, and the Z probing accuracy is ±5.0μm, allowing for more reliable contacts and greater Z-axis control for soft contact. The probing force is 200/300kg (available as an option). The optical system used is ASU/BCU-Ⅱ, and the operation system is Windows+VME. Optimum temperature control during testing and increased parallel die testing are also achieved with the Precio™ prober series.
    Documents

    No documents

    Similar Listings
    View All
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