Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The Datacon 8800 FC Quantum is a state-of-the-art flip chip platform designed to meet the challenges of modern flip chip production and future demands, offering user-friendly operation. This dedicated flip chip system provides a high-volume production solution with a perfect balance of precision and flexibility. With its advanced design, the 8800 FC Quantum can achieve an impressive throughput of up to 10,000 units per hour (UPH) without compromising process stability and reliability. FlipChip BonderDocuments
No documents
BESI / DATACON
8800 FC QUANTUM
Verified
CATEGORY
Flip Chip Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
106834
Wafer Sizes:
Unknown
Vintage:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / DATACON
8800 FC QUANTUM
CATEGORY
Flip Chip Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
106834
Wafer Sizes:
Unknown
Vintage:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The Datacon 8800 FC Quantum is a state-of-the-art flip chip platform designed to meet the challenges of modern flip chip production and future demands, offering user-friendly operation. This dedicated flip chip system provides a high-volume production solution with a perfect balance of precision and flexibility. With its advanced design, the 8800 FC Quantum can achieve an impressive throughput of up to 10,000 units per hour (UPH) without compromising process stability and reliability. FlipChip BonderDocuments
No documents