The RF-350 is an automatic, single-substrate, loadlocked production system that uses a 300mm diameter, inductively coupled ion source for large substrates. It is similar to the RF-210 in that it provides excellent uniformity from its inductively-coupled, highly-collimated, filamentless, RF ion source during RIBE or ion milling. The RF-350 offers maximized process flexibility due to its reactive gas capabilities and independent control of ion beam parameters and ion incident angle. Additionally, its modular design allows for a seamless and cost-effective upgrade from single substrate, loadlock processing to cassette-to-cassette loading. This makes the RF-350 a versatile and efficient tool for substrate processing.

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RF-350

The new Lancer™ Ion Beam Etch (IBE) System was designed for the development and production of next generation electronic devices found in smartphones, self-driving automobiles and other ‘internet-of-things’ devices that enable connectivity, functionality and mobility.

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