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TEL / TOKYO ELECTRON UNITY ME
    Description
    Oxide
    Configuration
    Oxide
    OEM Model Description
    UNITY™ Me is a cost effective dry etch system for 100/150/200mm wafer diameter, which has been attracting attention in recent years again as a highly efficient system and is still sold as a new product. There are rich variety of special chamber specifications, such as SCCM™, DRM for SiO2/SiN etch and UD chamber for Si/SiC trench etch. TEL offers a wide range of etch applications to the customer through closely collaboration in process demonstration using internal evaluation tools. Unity ME was originally made in Mass. But moved to Japan, supported 3 chambers and an ash or other small unit. Originally 200mm, some were converted to 300mm. TEL now manufactures this system again for 100-300mm.
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    TEL / TOKYO ELECTRON

    UNITY ME

    verified-listing-icon

    Verified

    CATEGORY

    Plasma Etch
    Last Verified: Over 60 days ago
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    56168


    Wafer Sizes:

    8"/200mm


    Vintage:

    2004

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    TEL / TOKYO ELECTRON UNITY ME
    TEL / TOKYO ELECTRONUNITY MEPlasma Etch
    Vintage: 2004Condition: Used
    Last VerifiedOver 60 days ago

    TEL / TOKYO ELECTRON

    UNITY ME

    verified-listing-icon

    Verified

    CATEGORY

    Plasma Etch
    Last Verified: Over 60 days ago
    listing-photo-319ba7a3d9d647b0ba068f6adb5d5eac-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    56168


    Wafer Sizes:

    8"/200mm


    Vintage:

    2004


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Oxide
    Configuration
    Oxide
    OEM Model Description
    UNITY™ Me is a cost effective dry etch system for 100/150/200mm wafer diameter, which has been attracting attention in recent years again as a highly efficient system and is still sold as a new product. There are rich variety of special chamber specifications, such as SCCM™, DRM for SiO2/SiN etch and UD chamber for Si/SiC trench etch. TEL offers a wide range of etch applications to the customer through closely collaboration in process demonstration using internal evaluation tools. Unity ME was originally made in Mass. But moved to Japan, supported 3 chambers and an ash or other small unit. Originally 200mm, some were converted to 300mm. TEL now manufactures this system again for 100-300mm.
    Documents

    No documents

    Similar Listings
    View All
    TEL / TOKYO ELECTRON UNITY ME
    TEL / TOKYO ELECTRON
    UNITY ME
    Plasma EtchVintage: 2004Condition: UsedLast Verified: Over 60 days ago
    TEL / TOKYO ELECTRON UNITY ME
    TEL / TOKYO ELECTRON
    UNITY ME
    Plasma EtchVintage: 2001Condition: UsedLast Verified: Over 60 days ago