Skip to main content



"This dry etch system is equipped with SCCM (Super Capacitively Coupled Module) special chamber configuration for 200mm nodes. The SCCM chamber was designed to improve low-k etch performance, reducing or eliminating the deposition of backside polymer at the wafer edge and bottom. The Unity ME system can be used for a wide range of plasma etch applications, including HARC, Dual Damascene, low-k dielectrics, poly gate, and shallow trench etch. The Unity ME system with SCCM chamber is a compact system designed to improve through-put and yield performance."

Active Listings



Inspection, Insurance, Appraisal, Logistics

Top Listings

    No products found
Have one like this?
List it with Moov and find the perfect buyer in no time at all.