Overview

"This dry etch system is equipped with SCCM (Super Capacitively Coupled Module) special chamber configuration for 200mm nodes. The SCCM chamber was designed to improve low-k etch performance, reducing or eliminating the deposition of backside polymer at the wafer edge and bottom. The Unity ME system can be used for a wide range of plasma etch applications, including HARC, Dual Damascene, low-k dielectrics, poly gate, and shallow trench etch. The Unity ME system with SCCM chamber is a compact system designed to improve through-put and yield performance."