Plasma Etch
Last Verified:Over 60 days ago
Moov goes beyond the transaction to ensure a seamless buying experience from start to finish.
Money Back Guarantee
Let Moov take the risk out of purchasing secondhand equipment with our 'No questions asked Money Back Guarantee' Learn more
Logistics
One stop shop for Moov-ing equipment anywhere globally.
Insurance
Moov-ing equipment can be risky. Let us take on that risk so you can relax while your equipment is in transit.
Refurbishment
Need a tool built to the required specifications? Moov's refurbishment team has over 20 years of experience.
Last Verified:Over 60 days ago
Condition:Used
Operational Status:
Product ID:45977
Wafer Sizes:8"/200mm
Vintage:1996
OXIDE ETCHER
ETCH
The Unity II is an etch system developed by TEL, which is part of their 200mm UNITY® series. The series is known for its reliability and has been improved upon with the development of the UNITY® II, the UNITY® IIe, and most recently the UNITY® M(e). The system provides a reliable platform for various chambers and utilizes two plasma sources: DRM (Dipole Ring Magnet), which is a MERIE source, and SCCM (Super Capacitively Coupled Module), which applies to dual high-frequency plasma sources. The DRM has been successful in Dielectric and Silicon Deep Trench etch applications, while the SCCM provides controlled plasma dissociation and independent control of plasma bias. The UNITY® series achieves excellent process performance for the 130 nm design rule and later generations, while also offering optimal productivity and reliability. It is based on ongoing refinements to a proven platform.
Last Verified:Over 60 days ago
Condition:Used
Operational Status:
Product ID:45977
Wafer Sizes:8"/200mm
Vintage:1996
OXIDE ETCHER
ETCH
The Unity II is an etch system developed by TEL, which is part of their 200mm UNITY® series. The series is known for its reliability and has been improved upon with the development of the UNITY® II, the UNITY® IIe, and most recently the UNITY® M(e). The system provides a reliable platform for various chambers and utilizes two plasma sources: DRM (Dipole Ring Magnet), which is a MERIE source, and SCCM (Super Capacitively Coupled Module), which applies to dual high-frequency plasma sources. The DRM has been successful in Dielectric and Silicon Deep Trench etch applications, while the SCCM provides controlled plasma dissociation and independent control of plasma bias. The UNITY® series achieves excellent process performance for the 130 nm design rule and later generations, while also offering optimal productivity and reliability. It is based on ongoing refinements to a proven platform.
Moov goes beyond the transaction to ensure a seamless buying experience from start to finish.
Money Back Guarantee
Let Moov take the risk out of purchasing secondhand equipment with our 'No questions asked Money Back Guarantee' Learn more
Logistics
One stop shop for Moov-ing equipment anywhere globally.
Insurance
Moov-ing equipment can be risky. Let us take on that risk so you can relax while your equipment is in transit.
Refurbishment
Need a tool built to the required specifications? Moov's refurbishment team has over 20 years of experience.