Description
MISSING PART: RF MATCHERConfiguration
Process ML Etch Back Wafer Shape Notch Wafer Cassette 8" Plastic Miraial SMIF Interface NO Equipment composition 1.Main Body 2.Machine controller 3.RF Rack 4.PC temperature controller 5.Exhaust set 1.Process chamber 1-1.Upper electrode Upper Electrode body Baffle plate Upper cooling plate Crystal electrode Shield ring(Quartz) Clamp ring(Ceramic) Temperature control range(20~60℃） 1-2.Lower electrode Electrostatic chuck Exhaust ring Insulator guard Insulator guard ring Temperature control range(-30~25℃） "Upper and lower electrode spacing setting range: 9～20ｍｍ±0.1㎜" 1-3.Sidewall Deposhield Temperature control range(室温～60℃） 1-4.Exhaust Throttle valve : CMLA-11 10Torr (Tyran General) APC : AC-2 (Tyran General) Capacitance manometer : CMLA-11 10Torr (Tyran General) 1-5.RF System Upper and lower electrode application method RF Gen DAIHEN NFG-20SA3 380KHz 2000W Matcher DAIHEN NFM-20SA2 380KHz 2000W Power splitter DAIHEN NFT-20SB 380KHz 2000W 1-6.Gas species(MFC Type) AERA FC-770AC GAS 1 CHF3 : 100sccm GAS 2 CF4 : 200sccm GAS 3 Ar : 1000sccm GAS 4 Ar : 100sccm GAS 5 O2 : 100sccm B.P.C He : 30sccm B.P.E He : 30sccm 1-7.EPD Monochromator(JOBIN YVON H-10V) Emission spectroscopy method Wavelength variable range : 200~800nm 2.L/L 2-1.Transport Robot transfer by 2-way operation Arm holder : Conductive Teflon coating Wafer sensor : OMRON E3Y-R2C43S) 3.Transport system 3-1.Indexer Carrier sensor : Transparent Uni-cassette method Wafer sensor output : ＞44.7μW (Safety measure) 3-2.H/A Tweezers : ceramic (Conductive Teflon coating) Transport : Robot transfer by 3-way operation 3-3.P/A Tweezers : Aluminum A5052(Conductive Teflon coating) Chuck : Aluminum A5056(Conductive Teflon coating) Aligner : Non-contact orientation flat detection 3-4.E/S Chuck : Aluminum A5056(Conductive Teflon coating) 4.Temperature controller Chiller SMC INR-341-54E Upper electrode :20~60℃ , Lower electrode : -30~10℃ 5. Pump Unit TMP STP-H751E(SEIKO SEIKI) 6.AC POWER BOX 6-1.Voltage drop transformer Isolation transformer 6-2.Transformer heating interlockOEM Model Description
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TEL / TOKYO ELECTRON
TE 8500
Verified
CATEGORY
Plasma Etch
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
33014
Wafer Sizes:
8"/200mm
Vintage:
1997
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Logistics Support
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Money Back Guarantee
Available
Transaction Insured by Moov
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Refurbishment Services
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TEL / TOKYO ELECTRON
TE 8500
Verified
CATEGORY
Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
33014
Wafer Sizes:
8"/200mm
Vintage:
1997
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
MISSING PART: RF MATCHERConfiguration
Process ML Etch Back Wafer Shape Notch Wafer Cassette 8" Plastic Miraial SMIF Interface NO Equipment composition 1.Main Body 2.Machine controller 3.RF Rack 4.PC temperature controller 5.Exhaust set 1.Process chamber 1-1.Upper electrode Upper Electrode body Baffle plate Upper cooling plate Crystal electrode Shield ring(Quartz) Clamp ring(Ceramic) Temperature control range(20~60℃） 1-2.Lower electrode Electrostatic chuck Exhaust ring Insulator guard Insulator guard ring Temperature control range(-30~25℃） "Upper and lower electrode spacing setting range: 9～20ｍｍ±0.1㎜" 1-3.Sidewall Deposhield Temperature control range(室温～60℃） 1-4.Exhaust Throttle valve : CMLA-11 10Torr (Tyran General) APC : AC-2 (Tyran General) Capacitance manometer : CMLA-11 10Torr (Tyran General) 1-5.RF System Upper and lower electrode application method RF Gen DAIHEN NFG-20SA3 380KHz 2000W Matcher DAIHEN NFM-20SA2 380KHz 2000W Power splitter DAIHEN NFT-20SB 380KHz 2000W 1-6.Gas species(MFC Type) AERA FC-770AC GAS 1 CHF3 : 100sccm GAS 2 CF4 : 200sccm GAS 3 Ar : 1000sccm GAS 4 Ar : 100sccm GAS 5 O2 : 100sccm B.P.C He : 30sccm B.P.E He : 30sccm 1-7.EPD Monochromator(JOBIN YVON H-10V) Emission spectroscopy method Wavelength variable range : 200~800nm 2.L/L 2-1.Transport Robot transfer by 2-way operation Arm holder : Conductive Teflon coating Wafer sensor : OMRON E3Y-R2C43S) 3.Transport system 3-1.Indexer Carrier sensor : Transparent Uni-cassette method Wafer sensor output : ＞44.7μW (Safety measure) 3-2.H/A Tweezers : ceramic (Conductive Teflon coating) Transport : Robot transfer by 3-way operation 3-3.P/A Tweezers : Aluminum A5052(Conductive Teflon coating) Chuck : Aluminum A5056(Conductive Teflon coating) Aligner : Non-contact orientation flat detection 3-4.E/S Chuck : Aluminum A5056(Conductive Teflon coating) 4.Temperature controller Chiller SMC INR-341-54E Upper electrode :20~60℃ , Lower electrode : -30~10℃ 5. Pump Unit TMP STP-H751E(SEIKO SEIKI) 6.AC POWER BOX 6-1.Voltage drop transformer Isolation transformer 6-2.Transformer heating interlockOEM Model Description
None ProvidedDocuments
No documents