TEL / TOKYO ELECTRON

TE 8500

TE5000 TEL’s first original dry etch tool

TE 5000

TELIUS SP 305 SCCM

TACTRAS VESTA

TACTRAS VIGUS-0

TACTRAS VIGUS

CELLESTA +

UNITY  IIE-855II 

TE 8500P

TE 8500(S)ATC

The TEL / TOKYO ELECTRON UNITY is a Etchers & Ashers system. The UNITY can be used with 100/150/200mm wafer sizes.
UNITY is TEL’s first original vacuum multi chamber tool. The UNITY was recognized in the prestigious VLSI Customer Satisfaction Survey (1998), as the World Leader in Etch System Performance. Various configurations are offered for wafer sizes from 150 to 300mm.

UNITY

Tactras™ is a highly reliable 300mm plasma etch system that enhances etch process productivity. Scaling at advanced technology nodes makes the etch process more and more crucial. Tactras™ provides customized solutions for high aspect ratio holes, trench etch, mask and dielectric etch, and BEOL dielectric etch. 

Successor to the Telius, generally configured for 6 chambers.

TACTRAS

TE8500ATC

TELIUS SP 305 DRM

TE 5000 ATC

TE 5000SATC

This oxide etcher is configured for Wafer Size:8", Wafer type: flat-zone, Rack type: V1 rack, Processing type: vacuum, Wafer loading type: normal. The TEL Unity II series has a variety of configuraton optons including up to 3 process chambers, 16 process gases / chamber, and various endpoint detection systems. The TEL Unity II series has S2 safety compliance.

UNITY II-855II

Certas™ is a series of environment-friendly, high-throughput gas chemical etch systems. Designed to deliver optimal solutions for advanced devices, Certas™ offers high etch selectivity, high uniformity, and excellent removal of residue and roughness.

Certas

TELIUS SP

UNITY IIE 844DD

TELIUS SCCM SHIN

UNITY IIE 855DD

TACTRUS NCCP	

TE 8500S

The TEL / TOKYO ELECTRON UNITY EP etcher is used for chemical vapor deposition. The TEL / TOKYO ELECTRON UNITY EP is compatible with 8" wafer size. Applications for the TEL UNITY EP include chemical vapor deposition (CVD) system is built for CVD metal and metal oxide films, enabling high volume manufacturing of state-of-the-art integrated circuits.

UNITY EP

TELIUS SCCM

SCCM SHIN

TE 8401

Certas LEAGA™ is an environment-friendly, high-throughput gas chemical etch system designed for 300mm wafers that provides surface etch and cleaning without the use of liquids. Its dry processing features watermark-free, unique selectivity performance over various SiO2 films and precise control of interface cleaning. It offers greater flexibility when combined with TEL’s cleaning system. Certas LEAGA™ supports a number of isotropic process requirements for 3D-structure devices with high utilization capability and low cost operation through its plasma-free solution. Up to six dual-wafer processing chambers can be installed on a single platform to satisfy various process requirements. Easily configurable process units enable device scaling and enhanced productivity. Certas LEAGA™ provides highly precise process solutions such as surface pre-cleaning of Si contact formation, oxide film removal and etch back, selective etch in high-aspect 3D structure, and precise recess process, and has been widely adopted by global semiconductor manufacturers from volume manufacturing to next generation development.

Certas LEAGA

TEL / TOKYO ELECTRON SCCM TE is a Etchers & Ashers system. The SCCM TE can produce wafer size of 12”

SCCM TE

TE 8501

TELIUS SP 305 SCCM TE

TE 5480

TACTRAS VIGUS RK3

TEL / TOKYO ELECTRON UNITY IIE 655II is a Etchers & Ashers system. The UNITY IIE 655II can produce wafer size of 8”.

UNITY IIE 655II

855 DD

nfusion 700 MP

TELIUS 305 SCCM

TACTRAS RLSA

TE 480 HGC

U2E-855SS

MB2 730HT

TELIUS SP VESTA

TE-8500SESC

The TEL / TOKYO ELECTRON SCCM is Etchers & Ashers system that processes oxidation.

SCCM

TE-850S ESC

UNITY™ Me is a cost effective dry etch system for 100/150/200mm wafer diameter, which has been attracting attention in recent years again as a highly efficient system and is still sold as a new product. There are rich variety of special chamber specifications, such as SCCM™, DRM for SiO2/SiN etch and UD chamber for Si/SiC trench etch. TEL offers a wide range of etch applications to the customer through closely collaboration in process demonstration using internal evaluation tools.

Unity ME was originally made in Mass. But moved to Japan, supported 3 chambers and an ash or other small unit. Originally 200mm, some were converted to 300mm.  TEL now manufactures this system again for 100-300mm.

UNITY ME

The TEL / TOKYO ELECTRON UNITY ii SCCM is Etchers & Ashers system. The UNITY ii SCCM can be used with 8” wafer size.

UNITY IIE 855SS

The TEL / TOKYO ELECTRON UNITY IIE 855 PP is a Etchers & Ashers system. The UNITY IIE 855 PP can produce wafer size of 8”.

UNITY IIE 855 PP

Wafer sizes 100mm, 150mm, 200mm. 1-4 Chambers, Process Ox, SiN, HM, EB, Contact, Via,
Trench, SAC, Spacer, DD

UNITY ME DRM

SP 3055DD DRM

The TEL / TOKYO ELECTRON UNITY II is Etchers & Ashers system. UNITY II can be used with an 8” wafer size
Introduced in 1995, the UNITY II platform has gained a solid reputation for being one of the most reliable platforms available.
Unity 2 was a 2 chamber tool, focused on 200mm wafers.

UNITY II

UltraTrimmer Plus brings unique trimming technology for 100/150/200mm wafer with industry leading corrective etch capabilities and best in class cost of ownership. To provide higher yield manufacturing, UltraTrimmer Plus™ proposes the most effective solution to reduce various material properties.

UltraTrimmer Plus

CELLESTA™ -i for 300mm wafer surface clean processing system provides enhanced productivity and significantly decreased footprint. The system incorporates up to twenty units of cleaning chambers and has much smaller footprint. Furthermore, it is equipped with integrated chemical recycle technology contributing less CoO, physical cleaning function for the particle removal on wafers; all of these functions contribute to achieve higher productivity. Additionally, this platform has excellent system extendibility, which is able to equip advanced bevel clean unit dedicated to wafer periphery and backside clean unit with less chemical consumption.

300mm wafer cleaning system, wet etch, uses hot IPA dry, can hold up to 20 cleaning chambers, 1000 wph throughput, can have bevel clean unit.

CELLESTA-i	

UME-85D

UNITY ME 85 SCCM

UNITY IIE 845DD

TE 8500PATC

TE 8500 ESC

TSP-30555SSS

TELIUS SCCM JIN

TE8500P-ESC

The UNITY M offers superior Cost of Ownership with a small footprint, and high throughput.

UNITY M

TE 7500M

UNITY II 845DD

UNITY ME 85 DDD

UNITY  II 65DD

"This dry etch system is equipped with SCCM (Super Capacitively Coupled Module) special chamber configuration for 200mm nodes. The SCCM chamber was designed to improve low-k etch performance, reducing or eliminating the deposition of backside polymer at the wafer edge and bottom. 
 
 The Unity ME system can be used for a wide range of plasma etch applications, including HARC, Dual Damascene, low-k dielectrics, poly gate, and shallow trench etch. The Unity ME system with SCCM chamber is a compact system designed to improve through-put and yield performance."

UNITY ME SSCM

Telius (300mm) etch systems.
Successor to the Unity, generally 4 chamber, but could support purge modules and other HW.

TELIUS

TELIUS SCCM SE+

UNITY IIE 85DI

TEL Etch 480 is TEL’s first single wafer dry etch tool

TE 480

TELIUS SP-308 SCCM

The TEL / TOKYO ELECTRON UNITY ME 85 TD is a dielectric etch system for 200mm / 8" wafer size is built on the Unity Me mainframe. Electrical Requirements : 208V. The TEL / TOKYO ELECTRON UNITY ME 85 TD is equipped with 3 DRM process chambers.

UNITY ME 85 TD

TELIUS 305 DRM

UNITY 65DD

UNITY II 65DP

UNITY II SCCM

This single-wafer, multi-chamber etcher is for dry etching and DDA plasma etch. The TEL UNITY IIE features ceramic church hardwares, ENI special automation matching networks, high temperature chiller, pressure monitors, ENI RF generators, SEIKO SEIKI pumps, and multi blade mechanical robotics for 8” wafer processing. Its process configuration includes 2 cassette chambers (N2), transfer chamber (N2), 2 process chambers (N2, O2, Ar, CF4, C4F6, C4F8, CHF3), and PA Chamber (N2).

Unity 2e was a more advanced Unity II with hardware and software improvements.

UNITY IIE

UNITY II DRM

UNITY 85DI

UNITY IIE 85DD

UNITY IIE 855 DP 

UNITY II 850 DRM

308 SCCM

TE 5000S

TACTRAS CHAMBER

TE 7500

Latest generation etcher - supports up to 12 chambers.

EPISODE UL

The CELLESTA™ -i MD is a TEL's most advanced 300mm single wafer clean system for 10nm technology node and beyond. The system has state-of-the-art cleaning capability which enables damage less clean of the well-patterned wafer surface and damage free particle removal. Pattern collapse free drying technology is also realized by implements of both chamber atmosphere control and performance improvement of IPA dispenser. The system has achieved higher productivity and lower running cost with the use of newly developed chemical recycle concept. The CELLESTA™- i MD offers scalability and will strongly support the establishment of the most challenging wafer surface clean process technologies using various chemicals for Cu and other metal exposed layer of next generation devices.\

300mm wafer cleaning system, wet etch, uses IPA dry with new method, can hold up to 20 cleaning chambers, 1000 wph throughput.

CELLESTA-i MD

UNITY II 85DL

Certas WING™ is the 2nd generation plasma-free gas chemical etch system from Tokyo Electron targeted at selective oxide film etching. Productivity of the new tool has been improved with twice the throughput while maintaining the same footprint. The Certas WING™ process capability has been expanded to achieve higher etch volumes and provide flexibility for etching of a wider variety of silicon based films that will be used in future semiconductor device manufacturing.

TEL / TOKYO ELECTRON

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Top TEL / TOKYO ELECTRON Etchers & Ashers

TE 8500

22 Listings

TE 5000

19 Listings

TELIUS SP 305 SCCM

12 Listings

TACTRAS VESTA

10 Listings

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