Lam Research Corporation acquired SEZ Group, the leading supplier of single-wafer clean technology and products to the global semiconductor manufacturing industry.

The SEZ 203 Spin-Processor is a single wafer processing system that can use up to three different chemical solutions in a programmable sequence for processing wafers. It is capable of processing wafers with sizes of 125mm, 150mm, and 200mm. It has options like Endpoint Detection System, ozone processing, and contamination-free robot handling. It supports applications such as Photolithography Yield Enhancement, Back Surface Metal Clean, and Silicon Etch. The system can recycle, heat, and filter chemical solutions or use them in a single pass mode.

LAM RESEARCH / SEZ

SP203

The SEZ 323 is a spin-processing system designed for high throughput cleaning and film removal applications for 300 mm semiconductor wafer processing. It has a robot on a linear tracking system that transports wafers from four cassettes to two identical process chambers that can apply up to three chemicals each. The system has a SEMATECH-compliant graphical user interface and touch screen, and offers options such as a retrofit kit for processing 200 mm wafers, a rinse and dry module, endpoint detection, and more. It supports applications such as cleaning, etching, backside etch & clean, silicon substrate etch, and wafer reclaim.

SP323

The Spin Etcher 201 is a single wafer etching machine that can chemically etch one side of a wafer without damaging the other. It can handle 6" to 8" wafers and use up to three different chemicals in one process cycle. The system is fully automatic, with a cassette-to-cassette handling system, and has a flexible control system. It also has a minimized clean room footprint due to its Through-the-wall design.

SP201

The DV-34BF is part of the Da Vinci Series, a single-wafer processing technology platform designed for high-volume manufacturing. It addresses new cleaning requirements for polymer removal and backside etch and clean, providing high-throughput and accurate wafer cleaning to maximize device yields. The four-chamber system performs a wide range of back-and frontside processes on 300 mm wafers and is optimized for emerging technologies such as high-k dielectrics, new metal gates, and non-volatile memory devices. It offers optimized process performance, high throughput, minimized footprint, advanced handling, reduced media consumption, flexible chemistry application, higher reliability, resulting in low CoO.

DV-34BF

The SEZ SP304 is a single chamber system that can handle up to three chemicals. It is compatible with both 200mm and 300mm wafer sizes. 

SP304

The SEZ 4300 is a 300mm single wafer processing system that combines SEZ’s process capability with high reliability and throughput. It uses a dual arm robot to transport wafers from four FOUPs to four process chambers, where two media (acid or solvent) can be used. The media can be recycled, heated, and filtered within the system or used in single pass mode. The system has an object-oriented software architecture with a Sematech compliant GUI and touch screen for easy operation. It offers a cost-effective throughput/footprint ratio and competitive CoO. Options like EPD and ozone processing are available to meet customer needs. Supported applications include etching for structuring, layer thinning, and layer stripping.

SP4300

RST 101

1200

The SEZ 223 is a spin-processing system designed for high throughput cleaning and film removal applications for semiconductor wafer processing. It has a robot that transports 200mm wafers from four cassettes to two identical process chambers, capable of applying up to three chemicals each. The system has an object-oriented software architecture with a Sematech compliant GUI and Touch Screen. It also has options like Offline process editor, Mini-Environment, DIW-Ozone Processing, SMIF, AGV, Frontside handling, Film Removal End Point Detection, and more. It supports applications such as Copper Backside & Wraparound Clean, Other Backside Metal Cleans, Backside Film Removal, Wafer Reclaim, Post-etch Polymer Removal, Oxide Etching, and Post-CMP-Cleaning.

SP223

The Da Vinci Prime (DVP) is an advanced single-wafer wet processing platform that combines SEZ’s proven Da Vinci technology with its newest capabilities. It is designed to address the increasing overlap of BEOL and FEOL applications and the emergence of new materials. The DVP features double-sided processing, non-damage defect removal, minimized watermark formation, and multi-chemical recirculation capabilities. It targets a mix of BEOL and FEOL applications and offers key benefits such as maximized throughput, enhanced surface defect removal, and reduced media consumption.

DV-PRIME

SP305

The DV-38F is the first product in the “Da Vinci” series, a single-wafer system with a modular, multi-chamber design. It specifically targets back-end-of-line processing of 300-mm diameter wafers characterized using 90-nanometer manufacturing process technology and smaller geometries.

DV-38F

The DV-28F is the first system in the Da Vinci Series, a revolutionary spin-processing platform for single-wafer cleaning. It is optimized for high-volume etch residue removal on 200mm wafers at the 90nm node and offers flexible chemistry application. The system delivers optimized process performance, high throughput, and reduced media consumption, resulting in low CoO.

DV-28F

SP200

The DV-24BF is a four-chamber system from the Da Vinci Series by SEZ, designed for high-volume manufacturing applications. It performs etch and clean, polymer removal, decontamination, and other back-and frontside processes on 200 mm wafers. The tool is optimized for emerging technologies such as high-k dielectrics, new metal gates, and non-volatile memory devices. It offers optimized process performance, high throughput, minimized footprint, advanced handling, reduced media consumption, flexible chemistry application, and higher reliability, resulting in low CoO.

DV-24BF

RST-100

The SEZ 4200 is a single wafer processing system that combines SEZ’s process capability with high throughput and reliability. It uses a dual arm robot to transport 200mm wafers from four cassettes to four process chambers, using one media for all chambers. The media can be recycled, heated, and filtered within the system or used in single pass mode. The system has an object-oriented software architecture with a Sematech compliant GUI and touch screen for easy operation. It has a cost-effective throughput/footprint ratio and competitive CoO. Options like Endpoint Detection System, ozone processing, and SMIF ensure application solutions that meet and exceed customer needs. Supported applications include polymer removal, metal pre-clean, and layer stripping.

SP4200

SP303

The SEZ 102 is a Spin-Processor for single wafer processing. It supports 3, 4, 5, and 6-inch wafers on 150mm and has multiple vertically integrated process chambers. The system is fully automatic and can recycle, heat, and filter chemical solutions. It supports a wide range of applications including photolithography yield enhancement, back surface metal clean, back surface film removal, bevel/edge film removal, silicon etch, stress relief, post-etch polymer removal, oxide etching, post CMP clean, film structuring (BEOL), wafer manufacturing enhancement, and GaAs processing.

LAM RESEARCH / SEZ

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SP323

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SP203

10 Listings

SP201

6 Listings

DV-34BF

5 Listings

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