Semitool is supplies electrochemical plating and wafer surface preparation equipment used by chip packaging and chip making companies around the world.

The Raider SP is a fully automated system with up to ten single-wafer process chambers for high volume production. The flexibility of its linear design makes it one of the most versatile wet cleaning, stripping and etching platforms in the industry. The tool can be equipped with our proprietary Capsule chamber, which allows side selectable processing. In addition, the system can be equipped with spray, immersion, megasonic, or vapor process chambers. Applications include wafer backside, bevel and edge clean for removal of unwanted copper and other contamination, post-etch polymer removal, critical pre-deposition cleans, and metal etching. The Raider SP is available to accommodate 150mm, 200mm & 300mm wafer sizes.

The Applied Raider SP can incorporate several types of cleaning methods, including spray, vapor, immersion, megasonics and anneal technologies with automated single or dual-side wafer processing for high volume manufacturing.

APPLIED MATERIALS (AMAT) / SEMITOOL

RAIDER SP	

The Raider™ SP310 is a 300mm single wafer, precision, high volume surface preparation system. It incorporates a variety of technologies including spray, vapor, immersion, megasonics, and anneal to provide automated single or dual-side wafer processing. This system is designed to provide efficient and effective surface preparation for semiconductor wafers.

APPLIED MATERIALS (AMAT) / SEMITOOL

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