Overview

Etch system delivers high-productivity silicon, metal, and dielectric etch. The Centura and Centura AP mainframe single-wafer, multi-chamber architectures enable integrated, sequential wafer processing in up to four process chambers for 150mm, 200mm, and 300mm wafers. For 150/200mm wafers, Applied Centura DPS® DTM system employs advanced deep reactive ion etch (DRIE) for a range of materials to precisely control etch wall smoothness and trench profile, while delivering high aspect ratio capability and achieving high throughput. Applied Centura DPS Plus is the industry standard for metal etch processes.