Description
LAM Rainbow 4526I - 150mm Plasma EtchConfiguration
200mm convertible: Yes Former process: oxidepets Dimensions & weight estimates: Mainframe dim (cm): 111.8 x 137.2 x 167.5 Mainframe weight (kg): 788 Bypack1 dim (cm): 55.9 x 81.3 x 110.5 Bypack1 weight (kg): 135 Bypack2 dim (cm): 55.9 x 22.9 x 76.2 Bypack2 weight (kg): 54OEM Model Description
The Rainbow® 4520i system is a single wafer, vacuum load-locked low pressure oxide system with two active processing chambers. It is designed for integrated isotropic/anisotropic profile on high aspect ratio contact and via structures. The Isotropic Module adds isotropic oxide etching capabilities to the existing anisotropic capabilities of the Rainbow 4520, providing excellent aluminum step coverage. The Isotropic Module is incorporated onto the entrance load-lock on the Rainbow 4520, requiring only one additional wafer handling step. Having two chambers on a single machine greatly reduces the possibility of cross contamination between processes, which minimizes wafer breakage and defect densities. The system has a high uptime of ≥ 85% and is capable of isotropic etching for dielectric (oxide) films. The Rainbow® 4520i system has several applications, including contact etch, planarization, via etch, trench mask etch, and pad etch.Documents
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LAM RESEARCH CORPORATION
RAINBOW 4520i
Verified
CATEGORY
Dry / Plasma Etch
Last Verified: Today
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
117185
Wafer Sizes:
6"/150mm
Vintage:
1995
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH CORPORATION
RAINBOW 4520i
CATEGORY
Dry / Plasma Etch
Last Verified: Today
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
117185
Wafer Sizes:
6"/150mm
Vintage:
1995
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
LAM Rainbow 4526I - 150mm Plasma EtchConfiguration
200mm convertible: Yes Former process: oxidepets Dimensions & weight estimates: Mainframe dim (cm): 111.8 x 137.2 x 167.5 Mainframe weight (kg): 788 Bypack1 dim (cm): 55.9 x 81.3 x 110.5 Bypack1 weight (kg): 135 Bypack2 dim (cm): 55.9 x 22.9 x 76.2 Bypack2 weight (kg): 54OEM Model Description
The Rainbow® 4520i system is a single wafer, vacuum load-locked low pressure oxide system with two active processing chambers. It is designed for integrated isotropic/anisotropic profile on high aspect ratio contact and via structures. The Isotropic Module adds isotropic oxide etching capabilities to the existing anisotropic capabilities of the Rainbow 4520, providing excellent aluminum step coverage. The Isotropic Module is incorporated onto the entrance load-lock on the Rainbow 4520, requiring only one additional wafer handling step. Having two chambers on a single machine greatly reduces the possibility of cross contamination between processes, which minimizes wafer breakage and defect densities. The system has a high uptime of ≥ 85% and is capable of isotropic etching for dielectric (oxide) films. The Rainbow® 4520i system has several applications, including contact etch, planarization, via etch, trench mask etch, and pad etch.Documents
No documents