ALPHA-303i is 300mm batch thermal processing system equipped functions from the high technology that is cultivated with ALPHA-8SE.
300mm Successor to the Alpha 8SE, smaller load of 100 wafers vs. 150 on previous models.

TEL / TOKYO ELECTRON

ALPHA(α)-303i

TELFORMULA™ is the semiconductor industry’s most advanced iso-thermal minibatch platform. TELFORMULA™ incorporates a number of innovative technologies specifically developed to address the industry’s need for a 300mm high speed batch platform capable of delivering short TAT (Turn Around Time) both suitable for product development and simultaneously capable of meeting demanding, high-volume production requirements.

TELFORMULA™ is the ideal platform for a wide variety of semiconductor processes including LPCVD Si (Poly, a-Si), Si3N4, SiO2, ALD High-k, ATM/LP Oxidation, Oxynitridation, etc.

TELFORMULA

TELINDY™ is an innovative thermal processing system for 300mm wafer which has all the functionality of high-reliable ALPHA-303i and TELFORMURA™ that enables short TAT thermal processing. Newly designed heater and process chamber expands its performance up to 125 wafers in a batch and provides various process applications with overwhelming throughput.

Successor to Alpha 303i, improved interface and expanded capacity to 125 wafer batches.

TELINDY

TELINDY PLUS™ represents the convergence of demonstrated experience and leading edge thermal processing technology. TELINDY PLUS™ incorporates specialized features originally developed for short TAT (Turn Around Time) on the TELFORMULA™ minibatch system as well as field proven, high productivity design elements from the previous generation TELINDY™ platform.

TELINDY PLUS™ applications range from traditional silicon treatments such as diffused oxides and anneals to LPCVD Si (Poly Si, a-Si), SiO2, Si3N4 to leading edge ALD SiO2, Si3N4 and high-k dielectrics as well as radical (non-plasma) oxidation.

Successor to Telindy, improved cassette stocker capacity and LPCVD capability.

TELINDY PLUS

TELINDY PLUS ALD

ALPHA-8S is the long-seller batch thermal processing system for silicon wafers up to 200mm. Maximizing the efficiency and productivity through continuous improvement, as a result, ALPHA-8S set the standard for vertical furnace. The system provides a wide range of process applications such as Wet/Dry Oxidation, Anneal, LPCVD of Si, Si3N4 and SiO2. Various type of UGK (Up Grade Kit) are available, which include a GUI controller and other options to enhance its productivity and expand the product’s life.

Successor to Alpha 8, 100-200mm vertical, improved user interfaces available.

ALPHA-8S

TELFORMULA ALD HIGH-K

TELFORMULA NITRIDE

ALPHA-8SE™ is a batch thermal processing system which covers multiple applications over a wide temperature range. The ALPHA-8SE™ was introduced for 200mm wafer processing in the mid 1990’s. Since its introduction, the ALPHA-8SE™ has undergone continuous improvements to productivity, reliability and stability enabling performance for today’s most advanced diffusion and deposition processes such as ALD (Atomic Layer Deposition), low pressure radical oxidation and low temperature nitrides. The ALPHA-8SE™ supports 100/150/200mm wafer sizes and up to 150 wafer batch size for semiconductor thin film applications including: oxidation & anneal, LPCVD of Si (Poly, a-Si), Si3N4, SiO2, and high-k ALD.

Successor to Alpha 8S, 100-200mm vertical, can handle high-k ALD low pressure oxide and low temp nitride.

ALPHA-8SE

First generation Alpha furnace, 200mm wafer vertical.

ALPHA 8

ALPHA 805

ALPHA IW-6D

TELINDY PLUS™ IRad™ is the definitive intersection between thermal large-batch and plasma processing. TELINDY PLUS™ IRad™ maintains all of the design advantages of the field proven, high productivity and reliable TELINDY PLUS™ platform while incorporating a damage-free plasma capability. Thus, the TELINDY PLUS™ IRad™ further extends the process domain of batch technology to new, lower temperature regimes while maintaining deposited film quality. TELINDY PLUS™ IRad™ provides a stable platform for high quality thin film deposition at low temperature which is increasingly desired for advanced device scaling and dense 3D structures. Predominant applications include ultra-low temperature ALD Si3N4 and SiO2. With the included dry gas cleaning capability, both down time reduction and superior particle performance are realized.

TELINDY PLUS IRad

UL 2604-10H

UL 2604 08 HS

VDF 610S

ALPHA 803

OFENTEL MINIBATCH (OXID)

IW 6C

ALPHA 802

VCF 615

ALPHA 805C

UL 2604-08H

A803 

IW-6

ALPHA-8SE™ i is a vertical batch thermal processing system for 200mm wafers. Released in 2018 by remodeling its predecessor ALPHA-8SE™ under the three concepts of innovation, inherit, and evolution, ALPHA-8SE™ i has received high acclaim for its stability and productivity.

ALPHA 8SEi

TEL / TOKYO ELECTRON ALPHA 808 is a Coaters and Developers system. The Coaters and Developerscan produce wafer size of 8”.

TEL / TOKYO ELECTRON

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ALPHA(α)-303i

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TELINDY

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