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TEL / TOKYO ELECTRON SYNAPSE
    Description
    Applications: This system bonds a product substrate and product chips with high-pressure air and high-temperature heart for IC development and manufacturing. This system is generally called a permanent bonder.
    Configuration
    - System Configuration: This system consist of wafer processing equipment and a peripheral device (air booster) that supplies high-pressure air. - Equipment Configuration: The equipment consist of two types of blocks: Carrier Station Block (CSB) and Gang Air Bonding Block (GAB).
    OEM Model Description
    None Provided
    Documents

    No documents

    TEL / TOKYO ELECTRON

    SYNAPSE

    verified-listing-icon

    Verified

    CATEGORY

    Bonders
    Last Verified: Over 60 days ago
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    44844

    Wafer Sizes:

    12"/300mm

    Vintage:

    2015

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
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    Transaction Insured by Moov
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    Refurbishment Services
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    TEL / TOKYO ELECTRON SYNAPSE
    TEL / TOKYO ELECTRONSYNAPSEBonders
    Vintage: 2015Condition: Used
    Last VerifiedOver 60 days ago

    TEL / TOKYO ELECTRON

    SYNAPSE

    verified-listing-icon

    Verified

    CATEGORY

    Bonders
    Last Verified: Over 60 days ago
    listing-photo-7b8d7fbc07bf47aa88b4c3c151911dd9-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44361/7b8d7fbc07bf47aa88b4c3c151911dd9/a1ecd857d4f64efb9dcffed68af97e2f_img20210622wa0019_mw.jpg
    listing-photo-7b8d7fbc07bf47aa88b4c3c151911dd9-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44361/7b8d7fbc07bf47aa88b4c3c151911dd9/0ea5378ccdd14f498bbce46a1f5d145b_2835f5e0a5be43028787f08d09c1ed1e1105c_mw.jpeg
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    44844

    Wafer Sizes:

    12"/300mm

    Vintage:

    2015

    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Applications: This system bonds a product substrate and product chips with high-pressure air and high-temperature heart for IC development and manufacturing. This system is generally called a permanent bonder.
    Configuration
    - System Configuration: This system consist of wafer processing equipment and a peripheral device (air booster) that supplies high-pressure air. - Equipment Configuration: The equipment consist of two types of blocks: Carrier Station Block (CSB) and Gang Air Bonding Block (GAB).
    OEM Model Description
    None Provided
    Documents

    No documents

    Similar Listings
    View All
    TEL / TOKYO ELECTRON SYNAPSE
    TEL / TOKYO ELECTRON
    SYNAPSE
    BondersVintage: 2015Condition: UsedLast Verified: Over 60 days ago