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ULVAC NE-950EX
    Description
    No description
    Configuration
    Form : Load Lock Type Configuration : Atmospheric Transfer Chamber Load Lock Chamber Transfer Chamber Process chamber Transfer device : Bernoulli transport Substrate size : dia.330 trays (dia.150 Wafer × 3) Process Power : Antenna RF 2 kW (13.56 MHz) 　　　　　　　　　　　Bias RF 2 kW (12.5 MHz) Process Gas : 8 gas systems (CHF3, Cl2, BCl3, etc.) Vacuum Pump : DRP × 2
    OEM Model Description
    None Provided
    Documents

    No documents

    ULVAC

    NE-950EX

    verified-listing-icon

    Verified

    CATEGORY

    Dry Etch
    Last Verified: Over 60 days ago
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    26129

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

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    ULVAC

    NE-950EX

    verified-listing-icon

    Verified

    CATEGORY

    Dry Etch
    Last Verified: Over 60 days ago
    listing-photo-744fda45b4704cf493b68fb6a4986527-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    26129

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    Form : Load Lock Type Configuration : Atmospheric Transfer Chamber Load Lock Chamber Transfer Chamber Process chamber Transfer device : Bernoulli transport Substrate size : dia.330 trays (dia.150 Wafer × 3) Process Power : Antenna RF 2 kW (13.56 MHz) 　　　　　　　　　　　Bias RF 2 kW (12.5 MHz) Process Gas : 8 gas systems (CHF3, Cl2, BCl3, etc.) Vacuum Pump : DRP × 2
    OEM Model Description
    None Provided
    Documents

    No documents

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    View All
    ULVAC NE-950EX
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