Description
No descriptionConfiguration
Form : Load Lock Type Configuration : Atmospheric Transfer Chamber Load Lock Chamber Transfer Chamber Process chamber Transfer device : Bernoulli transport Substrate size : dia.330 trays (dia.150 Wafer × 3) Process Power : Antenna RF 2 kW (13.56 MHz) Bias RF 2 kW (12.5 MHz) Process Gas : 8 gas systems (CHF3, Cl2, BCl3, etc.) Vacuum Pump : DRP × 2OEM Model Description
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ULVAC
NE-950EX
Verified
CATEGORY
Dry Etch
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
24162
Wafer Sizes:
6"/150mm
Vintage:
2011
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
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ULVAC
NE-950EX
Verified
CATEGORY
Dry Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
24162
Wafer Sizes:
6"/150mm
Vintage:
2011
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Form : Load Lock Type Configuration : Atmospheric Transfer Chamber Load Lock Chamber Transfer Chamber Process chamber Transfer device : Bernoulli transport Substrate size : dia.330 trays (dia.150 Wafer × 3) Process Power : Antenna RF 2 kW (13.56 MHz) Bias RF 2 kW (12.5 MHz) Process Gas : 8 gas systems (CHF3, Cl2, BCl3, etc.) Vacuum Pump : DRP × 2OEM Model Description
None ProvidedDocuments
No documents