<b>DXL2-800HS-BL-CE Characteristic :</b>
Handles wafer diameters up to 200mm(8 inch)
Advanced Stainless Porous Vacuum Chuck will support up to 98% of the wafer area and highly secured and protect wafer during the tape removal.
H.D.C.R(Highly Digital Control Recipe) Availlable.
TTS Unique Inline UV Technology and Longer UV Lamp lifetime.
Running Ultra Thin Wafer/ High Bump Wafer Capabity.
High Power Multi Wave UV Irradiator.(OPTION)