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TEIKOKU DXL 800HS LASER

Created On
March 15th, 2019
Guaranteed Accurate as of
9 months ago
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March 15th, 2019
9 months ago
Favorite
Copied!
Share
Product ID
17902
Make
TEIKOKU
Model
DXL 800HS LASER
Category
Packaging
Quantity
1
Serial Number
-
Vintage
-
Wafer Size
8"
Condition
As-Is
Other Information
Configuration
<b>DXL2-800HS-BL-CE Characteristic :</b> Handles wafer diameters up to 200mm(8 inch) Advanced Stainless Porous Vacuum Chuck will support up to 98% of the wafer area and highly secured and protect wafer during the tape removal. H.D.C.R(Highly Digital Control Recipe) Availlable. TTS Unique Inline UV Technology and Longer UV Lamp lifetime. Running Ultra Thin Wafer/ High Bump Wafer Capabity. High Power Multi Wave UV Irradiator.(OPTION)  
Description
-
Services Available for this Listing
Moov Insurance
Installation
Refurbished
Various / Other
Similar Tools
OEM Model Description
-