Description
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Suss Microtec MJB4 Precision Mask Aligner and UV Exposure System. Ideal, economical tool for laboratories and small series production. In its contact exposure modes, the equipment can achieve a resolution of 0.5 micrometers, a performance unsurpassed in any other comparable machine. Widely used for MEMS and optoelectronics applications. It is specially configured for handling nonstandard substrates such as hybrids, high-frequency components or fragile III-V materials such as GaAs or InP. Equipped with SUSS Splitfield microscope enabling fast and highly accurate alignment. Features and Benefits: Wafer and substrate handling up to dia. 100mm (wafers), 4 in. x 4 in. (substrates). Currently configured with 3 in. chuck. High precision X,Y, Theta alignment stage and microscope manipulator. Ergonomic operation. Touch panel graphical user interface. Printing Modes: UV400: Soft Contact 2.0 micrometers. Hard Contact 1.0 micrometers. Vacuum Contact less than 0.8 micrometers. UV300: Soft Contact 2.0 micormeters. Hard Contact 1.0 micrometers. Vacuum Contact less than 0.6 micrometers. The MJB4 is equipped with a XY Theta alignment stage using high precision, backlash-free micrometer spindles for X, Y and Theta. The travel range for X and Y is +/-5mm, for Theta +/-5 degrees. Substrate thickness compensation is easily adjustable allowing for a shift-free separation/contact movement. The manual Z-movement allows a maximum substrate thickness of up to 4mm.OEM Model Description
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SUSS MicroTec / KARL SUSS
HVMMFT
Verified
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Packaging
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
15717
Wafer Sizes:
Unknown
Vintage:
Unknown
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SUSS MicroTec / KARL SUSS
HVMMFT
Verified
CATEGORY
Packaging
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
15717
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Suss Microtec MJB4 Precision Mask Aligner and UV Exposure System. Ideal, economical tool for laboratories and small series production. In its contact exposure modes, the equipment can achieve a resolution of 0.5 micrometers, a performance unsurpassed in any other comparable machine. Widely used for MEMS and optoelectronics applications. It is specially configured for handling nonstandard substrates such as hybrids, high-frequency components or fragile III-V materials such as GaAs or InP. Equipped with SUSS Splitfield microscope enabling fast and highly accurate alignment. Features and Benefits: Wafer and substrate handling up to dia. 100mm (wafers), 4 in. x 4 in. (substrates). Currently configured with 3 in. chuck. High precision X,Y, Theta alignment stage and microscope manipulator. Ergonomic operation. Touch panel graphical user interface. Printing Modes: UV400: Soft Contact 2.0 micrometers. Hard Contact 1.0 micrometers. Vacuum Contact less than 0.8 micrometers. UV300: Soft Contact 2.0 micormeters. Hard Contact 1.0 micrometers. Vacuum Contact less than 0.6 micrometers. The MJB4 is equipped with a XY Theta alignment stage using high precision, backlash-free micrometer spindles for X, Y and Theta. The travel range for X and Y is +/-5mm, for Theta +/-5 degrees. Substrate thickness compensation is easily adjustable allowing for a shift-free separation/contact movement. The manual Z-movement allows a maximum substrate thickness of up to 4mm.OEM Model Description
None ProvidedDocuments
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