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SUSS MICROTEC HVMMFT

Created On
March 1st, 2019
Guaranteed Accurate as of
9 months ago
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March 1st, 2019
9 months ago
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Copied!
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Product ID
15717
Make
SUSS MICROTEC
Model
HVMMFT
Category
Packaging
Quantity
1
Serial Number
-
Vintage
-
Wafer Size
-
Condition
As-Is
Other Information
Configuration
Suss Microtec MJB4 Precision Mask Aligner and UV Exposure System. Ideal, economical tool for laboratories and small series production. In its contact exposure modes, the equipment can achieve a resolution of 0.5 micrometers, a performance unsurpassed in any other comparable machine. Widely used for MEMS and optoelectronics applications. It is specially configured for handling nonstandard substrates such as hybrids, high-frequency components or fragile III-V materials such as GaAs or InP. Equipped with SUSS Splitfield microscope enabling fast and highly accurate alignment. Features and Benefits: Wafer and substrate handling up to dia. 100mm (wafers), 4 in. x 4 in. (substrates). Currently configured with 3 in. chuck. High precision X,Y, Theta alignment stage and microscope manipulator. Ergonomic operation. Touch panel graphical user interface. Printing Modes: UV400: Soft Contact 2.0 micrometers. Hard Contact 1.0 micrometers.  Vacuum Contact less than 0.8 micrometers. UV300: Soft Contact 2.0 micormeters. Hard Contact 1.0 micrometers. Vacuum Contact less than 0.6 micrometers. The MJB4 is equipped with a XY Theta alignment stage using high precision, backlash-free micrometer spindles for X, Y and Theta. The travel range for X and Y is +/-5mm, for Theta +/-5 degrees. Substrate thickness compensation is easily adjustable allowing for a shift-free separation/contact movement. The manual Z-movement allows a maximum substrate thickness of up to 4mm.
Description
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Services Available for this Listing
Moov Insurance
Installation
Refurbished
Various / Other
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OEM Model Description
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