Description
No descriptionConfiguration
Tool condition: tool is de-installed & stored at cleanroom Process:RTP Software verison 1. Sequencer :MCS1.6.2 2. Load port firware:VER 5.04 3. MMC: VxWorks 5.5.1 Handling Module 1.Signal Tower:Front 2.Wafer size:300mm 3.Configuration:3xFOUP 4.Carrier ID reader:Yes 5. sequencer:Yes 6.license:Yes 7.ionizer:Yes 8.Frequency Converter :Yes 9.Power SupplyIonisator 603N3:Yes 10.Linear Track Controller 616N3:setting 550rpm 11.Step Motor Linear Track :Yes 12.VGA Data Switch 625S1:Yes 13.Cooling Station Sensors:Yes 14.Supply Filter:CIP3 & quartz blade 15.Robot Controller 616N1:Yes 16.Robot:Yes 17.Upper arm & Lower arm:Yes Upper: metal ; Low: Quartz 18.Distribution Box :Yes 19.Potentiometer R603 (FFU):Yes Process Module *2 1.Field Box:Yes 2.IGBT Box:Yes 3.Main Switch:Yes 4.O2 sensor module:Yes 5.O2 sensor display:Yes 6.Reactor Door:Yes 7.Door cylinder:Yes 8.Pyro chiller:Yes Only one under PM1 9.Control Rack:Yes 10.Filed Box Plate:Yes 11.Connector plate:Yes 12.Connector plate Control rack:Yes Gas box O2 150 SLM O2 2 SLM O2 20 SCCM O2 3 SCCM O2 200 SCCM O2 20 SLM N2 20 SLM N2 150 SLM N2 x N2H2 x H2 x H2 50 SLM NH3 30 SLM Ar 20 SLM Ar 150 SLM Sub-tool 1.Blower *2 Yes two chamber 2.Power rack Yes Missing/Damaged Parts List: Missing parts- PCW meter Missing parts- PCW valve Please inspect tool to reconfirmOEM Model Description
Helios family RTP systems offer unique double-side heating RTP technology. It can achieve the highest wafer temperature ramp rate while balancing wafer frontside and backside temperatures, eliminate pattern-loading effect, provide unique wafer stress management capabilities, satisfy technical requirements for RTP processes with different substrate thickness and device structures, and achieve the highest system productivity at the same time.Documents
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MATTSON
HELIOS
Verified
CATEGORY
RTP/RTA
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
16694
Wafer Sizes:
12"/300mm
Vintage:
Unknown
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
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MATTSON
HELIOS
Verified
CATEGORY
RTP/RTA
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
16694
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Tool condition: tool is de-installed & stored at cleanroom Process:RTP Software verison 1. Sequencer :MCS1.6.2 2. Load port firware:VER 5.04 3. MMC: VxWorks 5.5.1 Handling Module 1.Signal Tower:Front 2.Wafer size:300mm 3.Configuration:3xFOUP 4.Carrier ID reader:Yes 5. sequencer:Yes 6.license:Yes 7.ionizer:Yes 8.Frequency Converter :Yes 9.Power SupplyIonisator 603N3:Yes 10.Linear Track Controller 616N3:setting 550rpm 11.Step Motor Linear Track :Yes 12.VGA Data Switch 625S1:Yes 13.Cooling Station Sensors:Yes 14.Supply Filter:CIP3 & quartz blade 15.Robot Controller 616N1:Yes 16.Robot:Yes 17.Upper arm & Lower arm:Yes Upper: metal ; Low: Quartz 18.Distribution Box :Yes 19.Potentiometer R603 (FFU):Yes Process Module *2 1.Field Box:Yes 2.IGBT Box:Yes 3.Main Switch:Yes 4.O2 sensor module:Yes 5.O2 sensor display:Yes 6.Reactor Door:Yes 7.Door cylinder:Yes 8.Pyro chiller:Yes Only one under PM1 9.Control Rack:Yes 10.Filed Box Plate:Yes 11.Connector plate:Yes 12.Connector plate Control rack:Yes Gas box O2 150 SLM O2 2 SLM O2 20 SCCM O2 3 SCCM O2 200 SCCM O2 20 SLM N2 20 SLM N2 150 SLM N2 x N2H2 x H2 x H2 50 SLM NH3 30 SLM Ar 20 SLM Ar 150 SLM Sub-tool 1.Blower *2 Yes two chamber 2.Power rack Yes Missing/Damaged Parts List: Missing parts- PCW meter Missing parts- PCW valve Please inspect tool to reconfirmOEM Model Description
Helios family RTP systems offer unique double-side heating RTP technology. It can achieve the highest wafer temperature ramp rate while balancing wafer frontside and backside temperatures, eliminate pattern-loading effect, provide unique wafer stress management capabilities, satisfy technical requirements for RTP processes with different substrate thickness and device structures, and achieve the highest system productivity at the same time.Documents
No documents