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MATTSON / STEAG / AST 2900
    Description
    No missing parts.
    Configuration
    No Configuration
    OEM Model Description
    The 2900 RTP system addresses 0.25-0.13 micron RTP applications at, what STEAG believes to be, the best cost of ownership in the industry. It incorporates the advanced capabilities of the 3000 RTP tool and the field proven capabilities of the 2800 and 8800 systems. Applications include silicide/barrier formation, BPSG reflow and densification, thin gate dielectrics, thermal donor annihilation and multilayer annealing.
    Documents

    MATTSON / STEAG / AST

    2900

    verified-listing-icon

    Verified

    CATEGORY

    RTP/RTA
    Last Verified: Over 60 days ago
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    24030


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown

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    MATTSON / STEAG / AST

    2900

    verified-listing-icon

    Verified

    CATEGORY

    RTP/RTA
    Last Verified: Over 60 days ago
    listing-photo-219bc62114814a9aa22679fcc04da617-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/3080/219bc62114814a9aa22679fcc04da617/cde08ee866f742a1ae0e5232c783779b_911f5c92270a404995b9f30aa07cfac7_m.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    24030


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No missing parts.
    Configuration
    No Configuration
    OEM Model Description
    The 2900 RTP system addresses 0.25-0.13 micron RTP applications at, what STEAG believes to be, the best cost of ownership in the industry. It incorporates the advanced capabilities of the 3000 RTP tool and the field proven capabilities of the 2800 and 8800 systems. Applications include silicide/barrier formation, BPSG reflow and densification, thin gate dielectrics, thermal donor annihilation and multilayer annealing.
    Documents
    Similar Listings
    View All

    No Similar Listings