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Sikama Falcon Five Multi-Purpose Reflow Soldering System. Substrate materials: ceramics, glass, epoxy, paper based phenolic flex circuits, green tape, silicon wafers and porcelainized materials. Can be used as a linear oven for curing and drying applications or as a solder reflow system. Achieves rapid cure times with excellent adhesion and low volume resistivity in conductor materials. Three controlled heating zones. Max. Temp.: 400 deg C. Max. Substrate Size: 5 in. x 5.5 in. 120V, 50/60 Hz, 20A.OEM Model Description
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SIKAMA
FALCON 8500
Verified
CATEGORY
Reflow Oven
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
16755
Wafer Sizes:
Unknown
Vintage:
Unknown
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View AllSIKAMA
FALCON 8500
Verified
CATEGORY
Reflow Oven
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
16755
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Sikama Falcon Five Multi-Purpose Reflow Soldering System. Substrate materials: ceramics, glass, epoxy, paper based phenolic flex circuits, green tape, silicon wafers and porcelainized materials. Can be used as a linear oven for curing and drying applications or as a solder reflow system. Achieves rapid cure times with excellent adhesion and low volume resistivity in conductor materials. Three controlled heating zones. Max. Temp.: 400 deg C. Max. Substrate Size: 5 in. x 5.5 in. 120V, 50/60 Hz, 20A.OEM Model Description
None ProvidedDocuments
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