Sikama Falcon Five Multi-Purpose Reflow Soldering System. Substrate materials: ceramics, glass, epoxy, paper based phenolic flex circuits, green tape, silicon wafers and porcelainized materials. Can be used as a linear oven for curing and drying applications or as a solder reflow system. Achieves rapid cure times with excellent adhesion and low volume resistivity in conductor materials. Three controlled heating zones. Max. Temp.: 400 deg C. Max. Substrate Size: 5 in. x 5.5 in. 120V, 50/60 Hz, 20A.
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