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SIKAMA FALCON 8500
    Description
    No description
    Configuration
    Sikama Falcon Five Multi-Purpose Reflow Soldering System. Substrate materials: ceramics, glass, epoxy, paper based phenolic flex circuits, green tape, silicon wafers and porcelainized materials. Can be used as a linear oven for curing and drying applications or as a solder reflow system. Achieves rapid cure times with excellent adhesion and low volume resistivity in conductor materials. Three controlled heating zones. Max. Temp.: 400 deg C. Max. Substrate Size: 5 in. x 5.5 in. 120V, 50/60 Hz, 20A.
    OEM Model Description
    None Provided
    Documents

    No documents

    SIKAMA

    FALCON 8500

    verified-listing-icon

    Verified

    CATEGORY

    Reflow Oven
    Last Verified: Over 60 days ago
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    16755


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown

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    SIKAMA FALCON 8500
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    SIKAMA

    FALCON 8500

    verified-listing-icon

    Verified

    CATEGORY

    Reflow Oven
    Last Verified: Over 60 days ago
    listing-photo-Gdp431sEFUvnouKEI5n9v0zDtUKvROM4E01_46DMA5E-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/8GpEvJPy2xR_VLuMDsOOL12hQo47IOv-tZ0jmsJltK0/Gdp431sEFUvnouKEI5n9v0zDtUKvROM4E01_46DMA5E/lkMyBBo-JeiHjp1q1pmf34lnZNYmDRc4dqeHLhZ7USU_20190301_114808_f
    listing-photo-Gdp431sEFUvnouKEI5n9v0zDtUKvROM4E01_46DMA5E-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/8GpEvJPy2xR_VLuMDsOOL12hQo47IOv-tZ0jmsJltK0/Gdp431sEFUvnouKEI5n9v0zDtUKvROM4E01_46DMA5E/d8DHRzNEPoKYe3HMNANO9jaklQgTjHmq2SC0unS5FqE_20190301_114808_f
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    listing-photo-Gdp431sEFUvnouKEI5n9v0zDtUKvROM4E01_46DMA5E-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/8GpEvJPy2xR_VLuMDsOOL12hQo47IOv-tZ0jmsJltK0/Gdp431sEFUvnouKEI5n9v0zDtUKvROM4E01_46DMA5E/xGByXRp5U59pqn4SCQCCb0ooKmSOX985a5vllYUouCg_20190301_114808_f
    listing-photo-Gdp431sEFUvnouKEI5n9v0zDtUKvROM4E01_46DMA5E-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/8GpEvJPy2xR_VLuMDsOOL12hQo47IOv-tZ0jmsJltK0/Gdp431sEFUvnouKEI5n9v0zDtUKvROM4E01_46DMA5E/TsxdUI2Vkw2G4X9hAHnL3BAQKLq23tG-0P3j12piISQ_20190301_114808_f
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    16755


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    Sikama Falcon Five Multi-Purpose Reflow Soldering System. Substrate materials: ceramics, glass, epoxy, paper based phenolic flex circuits, green tape, silicon wafers and porcelainized materials. Can be used as a linear oven for curing and drying applications or as a solder reflow system. Achieves rapid cure times with excellent adhesion and low volume resistivity in conductor materials. Three controlled heating zones. Max. Temp.: 400 deg C. Max. Substrate Size: 5 in. x 5.5 in. 120V, 50/60 Hz, 20A.
    OEM Model Description
    None Provided
    Documents

    No documents

    Similar Listings
    View All
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