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Scientific Sealing Technology HV-2200-GT High Vacuum Thermal DAP Package Sealer. The HI VAC-2200 GT system is used for soldering, brazing or glass sealing of components requiring low residual gas environment or low moisture content. The system also has the capability of providing for a high vacuum, in-process bake for the removal of contaminating volatiles prior to backfilling with the controlled atmospheres of your choice. 220V, 1 Ph, 50/60 Hz, 100A. Typical Applications: Package sealing requiring controlled internal environment. Void free, flux free soldering for die attach, MCM assembly, power components and flip chip attach. Glass fusion and glass to metal sealing. Field emission flat panel display assembly. Glass to silicon, silicon to silicon wafer bonding. System Features: User friendly menu driven programming. Precise control of temperature (up to 1000 deg C), heating rates, dwell times and cooling rates.OEM Model Description
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SCIENTIFIC SEALING TECHNOLOGY / SST
HV-2200-GT
Verified
CATEGORY
Packaging
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
22932
Wafer Sizes:
Unknown
Vintage:
Unknown
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SCIENTIFIC SEALING TECHNOLOGY / SST
HV-2200-GT
Verified
CATEGORY
Packaging
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
22932
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Scientific Sealing Technology HV-2200-GT High Vacuum Thermal DAP Package Sealer. The HI VAC-2200 GT system is used for soldering, brazing or glass sealing of components requiring low residual gas environment or low moisture content. The system also has the capability of providing for a high vacuum, in-process bake for the removal of contaminating volatiles prior to backfilling with the controlled atmospheres of your choice. 220V, 1 Ph, 50/60 Hz, 100A. Typical Applications: Package sealing requiring controlled internal environment. Void free, flux free soldering for die attach, MCM assembly, power components and flip chip attach. Glass fusion and glass to metal sealing. Field emission flat panel display assembly. Glass to silicon, silicon to silicon wafer bonding. System Features: User friendly menu driven programming. Precise control of temperature (up to 1000 deg C), heating rates, dwell times and cooling rates.OEM Model Description
High Vacuum SealingDocuments
No documents
Similar Listings
View AllNo Similar Listings