Description
No descriptionConfiguration
Currently Configured for 300mm wafer size MFG Date: Dec 2012 EQUIPMENT DETAILS: Bump inspection system, 12" XPort, wafer scanner, ISO class 1 EFEM Outfitted with a dual arm robot XPort capable of handling: Standard wafer thicknesses (725um) down to 400 micron thickness for 12" wafers Standard features: Automated whole wafer handling Dual arm vacuum assist backside wafer handling End effector Integrated laminar clean air flow mini-environment (ULPA Filtration) Robot with integrated mapper Brooks Vision loadports, ATR9100, w/o Mapping Brooks Vision 12" load ports Capabilities: Local LCD user interface (30) Predefined fab specific indicators, labels, and buttons Customized indicator, labels, and buttons E84 OHT ready E99 carrier ID ready Class 3B laser at 830nm wavelength for 3D measurement. 3D sensor assy / computer, 5um / 8MHz, WS3880 Standard, 3D height verif wafer, 24um, 12" Ringlight assy, 3.5mm clearance Objective, 20x, long working dist, LMPLFL20XBD Dual OCR, Xport Ionizer assy, 44" Aerobar, XPort Clean air supply ionizer (AXi/XPort) Bar code reader, UPH and XPort, USB Computer, remote defect reviewOEM Model Description
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RUDOLPH / RVSI
WS-3880
Verified
CATEGORY
Defect Inspection
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
19724
Wafer Sizes:
Unknown
Vintage:
Unknown
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
RUDOLPH / RVSI
WS-3880
Verified
CATEGORY
Defect Inspection
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
19724
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Currently Configured for 300mm wafer size MFG Date: Dec 2012 EQUIPMENT DETAILS: Bump inspection system, 12" XPort, wafer scanner, ISO class 1 EFEM Outfitted with a dual arm robot XPort capable of handling: Standard wafer thicknesses (725um) down to 400 micron thickness for 12" wafers Standard features: Automated whole wafer handling Dual arm vacuum assist backside wafer handling End effector Integrated laminar clean air flow mini-environment (ULPA Filtration) Robot with integrated mapper Brooks Vision loadports, ATR9100, w/o Mapping Brooks Vision 12" load ports Capabilities: Local LCD user interface (30) Predefined fab specific indicators, labels, and buttons Customized indicator, labels, and buttons E84 OHT ready E99 carrier ID ready Class 3B laser at 830nm wavelength for 3D measurement. 3D sensor assy / computer, 5um / 8MHz, WS3880 Standard, 3D height verif wafer, 24um, 12" Ringlight assy, 3.5mm clearance Objective, 20x, long working dist, LMPLFL20XBD Dual OCR, Xport Ionizer assy, 44" Aerobar, XPort Clean air supply ionizer (AXi/XPort) Bar code reader, UPH and XPort, USB Computer, remote defect reviewOEM Model Description
None ProvidedDocuments
No documents