Category
Bonders
Last Verified:Over 60 days ago
Category
Bonders
Last Verified:Over 60 days ago
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Key Item Details
Condition:Used
Operational Status:
Product ID:23191
Wafer Sizes:Unknown
Vintage:Unknown
Description
No description available
Configuration
Newport 6000/6560A Laser Diode Controller. Comprehensive laser diode protection features. Advanced 16-bit control technology. Complete laser diode characterization (L,V, I). Intuitive front panel controls. Standard GPIB/IEEE-488.2 and RS-232 interfaces. Integrated 32 W temperature controller. 6560A Laser Diode Driver Module: Output Current Range (mA): 0-6000. Output Current Resolution: 0.0916. Output Current Accuracy: +/-(0.03 percent + 180 µA). Compliance Voltage (V): 5. Temperature Coefficient (ppm FS/ deg C): Less than 50. Short-Term Stability (1 h) (ppm FS): Less than 10. Long-Term Stability (24 h) (ppm FS): Less than 50. Noise/Ripple (rms) (µA). 100-240V, 50/60 Hz, CE.
Documents
OEM Model Description
Newport MRSI-605 AP Advanced Packaging Die Bonder, the ultimate solution for cutting-edge assembly needs in the semiconductor and electronic packaging markets. This advanced system offers unparalleled capabilities, catering to epoxy die attach, eutectic, and flip chip bonding, empowering manufacturers of MEMS, semiconductor packages, multi-chip modules, military and defense hybrids, microwave and RF circuits, and photonics packages.
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