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<span style="font-size: 18pt;">MRSI Systems 505 Pick and Place Assembly Work Cell</span> Specifications:Manufacturer Name: MRSI Systems Year:2000 Serial Number:080900-15306-201Model:505 Voltage:200-240 VOLTSFrequency:50/60 HERTZCurrent:10 AMPS10 Recommended Packaging Form: CUSTOM PALLET Dimensions:StandardOverall:72 x 60 x 96 IN - 4509 LBSMetric1828.80 x 1524.00 x 2438.40 mm - 2045.28 kgOEM Model Description
The MRSI-505 die bonder has in-line capability and is SMEMA compatible. It has high speed with overhead solid granite platform providing mechanical and thermal stability. It has ultra precision with proven worldwide ultra-precision placement accuracy. It has ease of programming with menu-driven “windows” for ease of programming and CAD downloading and uploading of management information capability. It has 360º die orientation with unique capability to locate randomly orient die over a full 360º range at high speeds. It has eutectic experience that handles a variety of eutectic attach applications such as gold silicon, gold tin and gold germanium. It has flip chip capability with integrated vision utilizing an upward-facing camera, application-specific lighting and optics and delicate handling with controlled contact force for delicate handling of GaAs devices.Documents
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NEWPORT
MRSI 505
Verified
CATEGORY
Die Sorters & Attachers
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
21395
Wafer Sizes:
Unknown
Vintage:
Unknown
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NEWPORT
MRSI 505
Verified
CATEGORY
Die Sorters & Attachers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
21395
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
<span style="font-size: 18pt;">MRSI Systems 505 Pick and Place Assembly Work Cell</span> Specifications:Manufacturer Name: MRSI Systems Year:2000 Serial Number:080900-15306-201Model:505 Voltage:200-240 VOLTSFrequency:50/60 HERTZCurrent:10 AMPS10 Recommended Packaging Form: CUSTOM PALLET Dimensions:StandardOverall:72 x 60 x 96 IN - 4509 LBSMetric1828.80 x 1524.00 x 2438.40 mm - 2045.28 kgOEM Model Description
The MRSI-505 die bonder has in-line capability and is SMEMA compatible. It has high speed with overhead solid granite platform providing mechanical and thermal stability. It has ultra precision with proven worldwide ultra-precision placement accuracy. It has ease of programming with menu-driven “windows” for ease of programming and CAD downloading and uploading of management information capability. It has 360º die orientation with unique capability to locate randomly orient die over a full 360º range at high speeds. It has eutectic experience that handles a variety of eutectic attach applications such as gold silicon, gold tin and gold germanium. It has flip chip capability with integrated vision utilizing an upward-facing camera, application-specific lighting and optics and delicate handling with controlled contact force for delicate handling of GaAs devices.Documents
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