Description

Planarization tool using water and abrasive discs

Configuration

MASS-PCB, SV200WV, Abrasive Planarizations SystemThe grinding machine SV 200 WV serves to remove the excess plugging paste fromprinted circuit boards and inner layers following the Via Hole Plugging process. Thatallows getting a flat uniform surface of the copper surface.The grinding disk is driven by a servo motor, the x-y movement is manual byhand.The basic frame is made up of a stable welded stainless steel rack. The outer jacketis made up of canted stainless sheet metal sheets. All the sheets allow be openingwith ease by entering catch locks and removing for allowing access.The grinding head is covered with a hood with aluminium glass profiles. The plant isbuilt up and designed such that all components are clearly arranged.Cooling water is transported via pump to the grinding head. On the bottom of themachine you can find the belt filter equipment, where the cooling water is filtered.The inner- or outer-layer of the printed circuit board is fixed on the aluminium workingplate by vacuum.The working area is protected by safety glass. The specific linear guides and theadjustable grinding pressure result in an excellent grinding performance and preventthe copper foil from possibly being ground through. The grinding head can belowered to the printed circuit board with an exactness of 0,22 μm (0,0056 mil).One turn (100 digits) eaquals 22μm (0,56 mil).Technical data:Plant length: 1400 mmPlant width: 1100 mmPlant height: 1700 mmWorking height: 980 mmWeight 1000 KgAdjustment precision 0,22 μmVacuum working surface: 610 x 915 mm (24 x 36”)Servo controlled turning of the grinding disks: 1000, 2000, 3000 rpmPrinted circuit board spectrum:Gauge from / to: 0,3 – 15 mmMaximum printed circuit board size: 610 x 915 mm (24 x 36”)Electric connection:Connected load: 5 kWWorking voltage: 3 x 400/480V, 3P, N, PE, 50/60 HzCompressed air connection: 6 barFilter unit: 60 l Water