Verified
Bonders
Last Verified:Over 60 days ago
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Verified
Last Verified:Over 60 days ago
Condition:Used
Operational Status:
Product ID:22556
Wafer Sizes:12"/300mm
Vintage:2006
No description available
<p>Tool is running production.</p><p>Inspect to confirm configuration and condition of tool.</p><p> </p><p>DIE ATTACH ESEC 2008HS3 plus</p><p> </p><p>Stack loader</p><p>Magazine to magazine</p><p>Bond time: 0 - 32 sec</p><p>Bond force: 0.5 N - 50 N</p><p>Bond accuracy: 25 um @ 3 sigma</p><p>Pad down set: 0 - 3 mm / 0 - 120 mil</p><p>Max. Pitch: 80 mm / 3.1"</p><p>metal lead frames (e.g. SOT, SOIC, TSOP and QFN)</p><p>organic substrates (e.g. BGA, Flex BGA, Singulated BGA, ceramics)</p><p>Lead frame / substrate length: 120-260mm</p><p><span style="color: rgb(62, 62, 60);">Lead frame / substrate </span>width: 9-90mm</p><p><span style="color: rgb(62, 62, 60);">Lead frame / substrate </span>thickness: 0.1-0.4mm</p><p><span style="color: rgb(62, 62, 60);">Lead frame / substrate </span>pitch: max. 80mm</p><p>Max. 3000 die per pitch</p><p>Max. 12000 die per lead frame</p><p>X Range: Max. 80 mm / 3.15"</p><p>Y-Bond range: Max. 66 mm / 2.6" (Leadframe width 90 mm / 3.54")</p><p>Die size: 10 mil (0.25 mm) - 1" (25.4 mm)</p><p>Die rotation angle: 270°</p><p>Magazines length: 120 - 270 mm / 4.72 - 10.23"</p><p>Magazines width: 12 - 90 mm / 0.47 - 3.54"</p><p>Magazines height: 60 - 160 mm / 2.36 - 6.3"</p><p>Wafer handler move method: 8" all & 12" half move</p>
The ESEC 2008hs3 Plus is a die bonder manufactured by ESEC. It is designed to handle wafers up to 300mm in size and has a bond accuracy of 25 um @ 3 sigma. This tool is capable of precisely attaching dies to substrates with a high degree of accuracy, making it a valuable tool in the semiconductor manufacturing process.
Verified
Last Verified:Over 60 days ago
Condition:Used
Operational Status:
Product ID:22556
Wafer Sizes:12"/300mm
Vintage:2006
No description available
<p>Tool is running production.</p><p>Inspect to confirm configuration and condition of tool.</p><p> </p><p>DIE ATTACH ESEC 2008HS3 plus</p><p> </p><p>Stack loader</p><p>Magazine to magazine</p><p>Bond time: 0 - 32 sec</p><p>Bond force: 0.5 N - 50 N</p><p>Bond accuracy: 25 um @ 3 sigma</p><p>Pad down set: 0 - 3 mm / 0 - 120 mil</p><p>Max. Pitch: 80 mm / 3.1"</p><p>metal lead frames (e.g. SOT, SOIC, TSOP and QFN)</p><p>organic substrates (e.g. BGA, Flex BGA, Singulated BGA, ceramics)</p><p>Lead frame / substrate length: 120-260mm</p><p><span style="color: rgb(62, 62, 60);">Lead frame / substrate </span>width: 9-90mm</p><p><span style="color: rgb(62, 62, 60);">Lead frame / substrate </span>thickness: 0.1-0.4mm</p><p><span style="color: rgb(62, 62, 60);">Lead frame / substrate </span>pitch: max. 80mm</p><p>Max. 3000 die per pitch</p><p>Max. 12000 die per lead frame</p><p>X Range: Max. 80 mm / 3.15"</p><p>Y-Bond range: Max. 66 mm / 2.6" (Leadframe width 90 mm / 3.54")</p><p>Die size: 10 mil (0.25 mm) - 1" (25.4 mm)</p><p>Die rotation angle: 270°</p><p>Magazines length: 120 - 270 mm / 4.72 - 10.23"</p><p>Magazines width: 12 - 90 mm / 0.47 - 3.54"</p><p>Magazines height: 60 - 160 mm / 2.36 - 6.3"</p><p>Wafer handler move method: 8" all & 12" half move</p>
The ESEC 2008hs3 Plus is a die bonder manufactured by ESEC. It is designed to handle wafers up to 300mm in size and has a bond accuracy of 25 um @ 3 sigma. This tool is capable of precisely attaching dies to substrates with a high degree of accuracy, making it a valuable tool in the semiconductor manufacturing process.
Moov goes beyond the transaction to ensure a seamless buying experience from start to finish.
Money Back Guarantee
Let Moov take the risk out of purchasing secondhand equipment with our 'No questions asked Money Back Guarantee' Learn more
Logistics
One stop shop for Moov-ing equipment anywhere globally.
Insurance
Moov-ing equipment can be risky. Let us take on that risk so you can relax while your equipment is in transit.
Refurbishment
Need a tool built to the required specifications? Moov's refurbishment team has over 20 years of experience.