Wet processing
Last Verified:Over 60 days ago
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Last Verified:Over 60 days ago
Condition:Used
Operational Status:
Product ID:47696
Wafer Sizes:12"/300mm
Vintage:2005
No description available
Config: 2f2d Chamber A Process : Wafer surface clean Chuck : Vacuum Chuck SPRAY : Soft Spray N2 10~100NL/min Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 3000rpm Spin Dry only Chamber B Process : Wafer surface clean Chuck : Vacuum Chuck SPRAY : Soft Spray N2 10~100NL/min Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 3000rpm Spin Dry only Chamber C Process : Wafer Backside clean Chuck : Mechanical Chuck SPRAY : Soft Spray N2 10~200NL/min Burush : PVA Burush Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 2400rpm Spin Dry only Chamber D Process : Wafer Backside clean Chuck : Mechanical Chuck SPRAY : Soft Spray N2 10~200NL/min Burush : PVA Burush Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 2400rpm Spin Dry only Software Version (include revision #) V242B000 System Power Rating 208AC 3-phase (eg. 110 AC 3-Phase for System) Loading Configuration 3 load ports (eg. 6 load positions for furnace or dual auto-indexer loaders) Process Modules Qty. 1 Loadport Qty 3 Power supply unit Qty 1 Vendor Chm Model Chemicals / Gases Used (not to use Micron Proprietary names) U03 SS(Surface) CO2Water U04 SS(Surface) CO2Water U05 SSR(Backside) CO2Water U06 SSR(Backside) CO2Water
Wafer Scrubber
Last Verified:Over 60 days ago
Condition:Used
Operational Status:
Product ID:47696
Wafer Sizes:12"/300mm
Vintage:2005
No description available
Config: 2f2d Chamber A Process : Wafer surface clean Chuck : Vacuum Chuck SPRAY : Soft Spray N2 10~100NL/min Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 3000rpm Spin Dry only Chamber B Process : Wafer surface clean Chuck : Vacuum Chuck SPRAY : Soft Spray N2 10~100NL/min Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 3000rpm Spin Dry only Chamber C Process : Wafer Backside clean Chuck : Mechanical Chuck SPRAY : Soft Spray N2 10~200NL/min Burush : PVA Burush Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 2400rpm Spin Dry only Chamber D Process : Wafer Backside clean Chuck : Mechanical Chuck SPRAY : Soft Spray N2 10~200NL/min Burush : PVA Burush Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ Spin DRY : 2400rpm Spin Dry only Software Version (include revision #) V242B000 System Power Rating 208AC 3-phase (eg. 110 AC 3-Phase for System) Loading Configuration 3 load ports (eg. 6 load positions for furnace or dual auto-indexer loaders) Process Modules Qty. 1 Loadport Qty 3 Power supply unit Qty 1 Vendor Chm Model Chemicals / Gases Used (not to use Micron Proprietary names) U03 SS(Surface) CO2Water U04 SS(Surface) CO2Water U05 SSR(Backside) CO2Water U06 SSR(Backside) CO2Water
Wafer Scrubber
Moov goes beyond the transaction to ensure a seamless buying experience from start to finish.
Money Back Guarantee
Let Moov take the risk out of purchasing secondhand equipment with our 'No questions asked Money Back Guarantee' Learn more
Logistics
One stop shop for Moov-ing equipment anywhere globally.
Insurance
Moov-ing equipment can be risky. Let us take on that risk so you can relax while your equipment is in transit.
Refurbishment
Need a tool built to the required specifications? Moov's refurbishment team has over 20 years of experience.