Description
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Processing method: Stealth dicing Workpiece size: φ8" X-axis (Chuck table) Processing range: 210mm Max. processing speed: 1 - 1,000mm/sec Y-axis (Chuck table) Processing range: 210mm Index step: 0.0001mm Positioning accuracy: 0.003/310mm (Single error)0.002/5mm Y-axis (Z2axis processing point) Processing range Index step Positioning Z-axis Moving resolution: 0.0001mm Repeatability accuracy: 0.001mm Θ-axis (Chuck table) Max. rotating angle: 380degOEM Model Description
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.Documents
DISCO
DFL7340
Verified
CATEGORY
Scribing, Cutting, Dicing
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
25194
Wafer Sizes:
Unknown
Vintage:
2009
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DISCO
DFL7340
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
25194
Wafer Sizes:
Unknown
Vintage:
2009
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available