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Silicon Process Basic Features HAMAMATSU Stealth Dicing Engine for Silicon: Laser Head in fixed position Chuck Table moving in X/Y direction GUI with Touch Screen Image rocessing System with Auto Focus Fully Automatic 8inch dia. Frame Handling System 8inch dia. Chuck Table Fully Automatic Alignment System Auto Focus Adjust IR Camera One Cassette Same Flow System Overseas Transformer 380V/3P-50Hz CE Mark and EMC Conformity English Documentation Other/Optional Features UPS DFPC to process cavities with different depths, including: a) Special HASEN to cut area without cavities; b) Special laser focus function JF for each cutting channel; c) Special laser focus function to define reference focus plane Kit for cutting wafers from backside (Special chuck, Porous sheet, Sheet clamping, Transfer Arm) Handy BCR for recipe loading SECS/GEM ESD Compliance Password protection by User (PWLv4) Laser edge off cut including edge alignment Mapping pass reductionOEM Model Description
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.Documents
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DISCO
DFL7340
Verified
CATEGORY
Scribing, Cutting, Dicing
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
24419
Wafer Sizes:
Unknown
Vintage:
Unknown
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DISCO
DFL7340
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
24419
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Silicon Process Basic Features HAMAMATSU Stealth Dicing Engine for Silicon: Laser Head in fixed position Chuck Table moving in X/Y direction GUI with Touch Screen Image rocessing System with Auto Focus Fully Automatic 8inch dia. Frame Handling System 8inch dia. Chuck Table Fully Automatic Alignment System Auto Focus Adjust IR Camera One Cassette Same Flow System Overseas Transformer 380V/3P-50Hz CE Mark and EMC Conformity English Documentation Other/Optional Features UPS DFPC to process cavities with different depths, including: a) Special HASEN to cut area without cavities; b) Special laser focus function JF for each cutting channel; c) Special laser focus function to define reference focus plane Kit for cutting wafers from backside (Special chuck, Porous sheet, Sheet clamping, Transfer Arm) Handy BCR for recipe loading SECS/GEM ESD Compliance Password protection by User (PWLv4) Laser edge off cut including edge alignment Mapping pass reductionOEM Model Description
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.Documents
No documents