Description
No descriptionConfiguration
Loader Port: 2 Ports Robot Arm: Dual (U Arm) Aligner: Position Table (12" & 13") Wafer Warpage: 4mm Spindle: Z1 & Z2 Spindle Height Guage: Wafer Thickness Check During Grinding Chuck Table: CHUCK A, B, C System: Win EmbeddedOEM Model Description
The Disco DFG8560 is a Fully Automatic In-Feed Surface Grinder that supports advancements for thinner and larger wafers up to Φ300 mm. It is the successor to the DFG800 series and has inherited grinding specifications with an established reputation1. The equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.Documents
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DISCO
DFG8560
Verified
CATEGORY
Polishing and Grinding
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
15188
Wafer Sizes:
12"/300mm
Vintage:
2016
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Logistics Support
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Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
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DISCO
DFG8560
Verified
CATEGORY
Polishing and Grinding
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
15188
Wafer Sizes:
12"/300mm
Vintage:
2016
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Loader Port: 2 Ports Robot Arm: Dual (U Arm) Aligner: Position Table (12" & 13") Wafer Warpage: 4mm Spindle: Z1 & Z2 Spindle Height Guage: Wafer Thickness Check During Grinding Chuck Table: CHUCK A, B, C System: Win EmbeddedOEM Model Description
The Disco DFG8560 is a Fully Automatic In-Feed Surface Grinder that supports advancements for thinner and larger wafers up to Φ300 mm. It is the successor to the DFG800 series and has inherited grinding specifications with an established reputation1. The equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.Documents
No documents