Back to Previous

DAITRON DBM-602R

Created On
October 6th, 2020
Guaranteed Accurate as of
22 days ago
Copied!
Share
October 6th, 2020
22 days ago
Copied!
Share
Product ID
26012
Make
DAITRON
Model
DBM-602R
Category
Wafer Grinding, Lapping, Polishing
Quantity
4
Serial Number
-
Vintage
2011
Wafer Size
-
Condition
As-Is
Other Information
Configuration
Target wafer : Sapphire board (dia.25 ~ 150 / 80 ~ 500 μm) Tip size : Min 200 × 200 μm Y-axis stroke : 158 mm, Feed speed Max 200 mm/sec θ-axis stroke : 120° Feed rate Max 45°/sec Z-axis stroke : 30 mm, Feed rate Max 20 mm /sec Stage Size : DTF2-8-1/Mechanically fixed Ultra high/width : 160 mm /block width 2 mm
Description
-
Listings information displayed on Moov.co is not a representation or warranty of any kind, and has been provided to us or extracted directly from the various suppliers and sources. Unless stated otherwise, Moov has not independently verified this information.
Services Available for this Listing
Moov Insurance
Installation
Refurbished
Various / Other
Similar Tools
OEM Model Description
-