Description
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Target wafer : Sapphire board (dia.25 ~ 150 / 80 ~ 500 μm) Tip size : Min 200 × 200 μm Y-axis stroke : 158 mm, Feed speed Max 200 mm/sec θ-axis stroke : 120° Feed rate Max 45°/sec Z-axis stroke : 30 mm, Feed rate Max 20 mm /sec Stage Size : DTF2-8-1/Mechanically fixed Ultra high/width : 160 mm /block width 2 mmOEM Model Description
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DAITRON
DBM-602R
Verified
CATEGORY
Scribing, Cutting, Dicing
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
26012
Wafer Sizes:
Unknown
Vintage:
2011
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Logistics Support
Available
Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
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Similar Listings
View AllDAITRON
DBM-602R
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
26012
Wafer Sizes:
Unknown
Vintage:
2011
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Target wafer : Sapphire board (dia.25 ~ 150 / 80 ~ 500 μm) Tip size : Min 200 × 200 μm Y-axis stroke : 158 mm, Feed speed Max 200 mm/sec θ-axis stroke : 120° Feed rate Max 45°/sec Z-axis stroke : 30 mm, Feed rate Max 20 mm /sec Stage Size : DTF2-8-1/Mechanically fixed Ultra high/width : 160 mm /block width 2 mmOEM Model Description
None ProvidedDocuments
No documents