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ATV TECHNOLOGY SRO 704
    Description
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    Configuration
    Trion Technology Sirus T2 Tabletop RIE Reactive Ion Etcher. Plasma etching system designed to etch dielectrics and other films that require fluorine-based chemistries. Processes have been developed for etching silicon, silicon dioxide, silicon nitride, quartz, polyimide, tantalum, tungsten and other materials. Small footprint and robust design make it ideal for the lab environment. Good profile control, high sensitivity and good uniformity. 200mm bottom electrode. PC interface with touchscreen. Four MFC gas inputs, previous gases used AR, SF6, O2, CF4. Automatic tuning with 13.56 MHz 600W RF generator. Automatic pressure control package. Includes recirculating chiller. Turbo pump and roughing pump included. Endpoint detection in photo can be added at additional price. Year of Mfg.: 2011. Very Nice Condition.
    OEM Model Description
    None Provided
    Documents

    No documents

    ATV TECHNOLOGY

    SRO 704

    verified-listing-icon

    Verified

    CATEGORY

    PCB / SMT
    Last Verified: Over 60 days ago
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    21784


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown

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    ATV TECHNOLOGY SRO 704
    ATV TECHNOLOGYSRO 704PCB / SMT
    Vintage: 2001Condition: Used
    Last VerifiedOver 60 days ago

    ATV TECHNOLOGY

    SRO 704

    verified-listing-icon

    Verified

    CATEGORY

    PCB / SMT
    Last Verified: Over 60 days ago
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    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    21784


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    Trion Technology Sirus T2 Tabletop RIE Reactive Ion Etcher. Plasma etching system designed to etch dielectrics and other films that require fluorine-based chemistries. Processes have been developed for etching silicon, silicon dioxide, silicon nitride, quartz, polyimide, tantalum, tungsten and other materials. Small footprint and robust design make it ideal for the lab environment. Good profile control, high sensitivity and good uniformity. 200mm bottom electrode. PC interface with touchscreen. Four MFC gas inputs, previous gases used AR, SF6, O2, CF4. Automatic tuning with 13.56 MHz 600W RF generator. Automatic pressure control package. Includes recirculating chiller. Turbo pump and roughing pump included. Endpoint detection in photo can be added at additional price. Year of Mfg.: 2011. Very Nice Condition.
    OEM Model Description
    None Provided
    Documents

    No documents

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