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ATV Technologie SRO 702 IR Vacuum Reflow Brazing RTA. The perfect soldering systems, solder reflow ovens (SRO) with rapid thermal annealing and brazing capability are IR lamp heated multi-purpose cold wall process ovens. The SRO is ideal for R&D, process development as well for low to high volume production. Die attachment, IGBT/DBC, high vacuum encapsulation, MEMS package sealing, IR sensor/Crystal package sealing, wafer level packaging, thermo electric cooler/Peltier, low moisture package sealing, high power LED, laser bar, Getter activation, alloying, wafer bump/solder ball reflow, pin fin heat sink, backing, flip chip, 3 D-CSP, diffusion bonding, CPV, thermo compression bonding, pin fins, Hybrid assembly, MMIC die attachment, power modules, electric vehicle controls, power solar cells. Temperature: up to 1100 deg C. Fast heated plate ramping. Ramping up greater than 3.5 deg C/sec. Ramping down greater than 2 deg C/sec. Rapid single wafer processing greater than 50 deg C/sec. Heated Area: 147 x 217mm. 208V, 3 Ph, 60 Hz, 25A, CE.OEM Model Description
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ATV TECHNOLOGY
SRO 704
Verified
CATEGORY
PCB / SMT
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
17653
Wafer Sizes:
Unknown
Vintage:
Unknown
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ATV TECHNOLOGY
SRO 704
Verified
CATEGORY
PCB / SMT
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
17653
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
ATV Technologie SRO 702 IR Vacuum Reflow Brazing RTA. The perfect soldering systems, solder reflow ovens (SRO) with rapid thermal annealing and brazing capability are IR lamp heated multi-purpose cold wall process ovens. The SRO is ideal for R&D, process development as well for low to high volume production. Die attachment, IGBT/DBC, high vacuum encapsulation, MEMS package sealing, IR sensor/Crystal package sealing, wafer level packaging, thermo electric cooler/Peltier, low moisture package sealing, high power LED, laser bar, Getter activation, alloying, wafer bump/solder ball reflow, pin fin heat sink, backing, flip chip, 3 D-CSP, diffusion bonding, CPV, thermo compression bonding, pin fins, Hybrid assembly, MMIC die attachment, power modules, electric vehicle controls, power solar cells. Temperature: up to 1100 deg C. Fast heated plate ramping. Ramping up greater than 3.5 deg C/sec. Ramping down greater than 2 deg C/sec. Rapid single wafer processing greater than 50 deg C/sec. Heated Area: 147 x 217mm. 208V, 3 Ph, 60 Hz, 25A, CE.OEM Model Description
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