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APPLIED MATERIALS (AMAT) REFLEXION
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    Key Item Details

    Condition:Used

    Operational Status:

    Product ID:49775

    Wafer Sizes:Unknown

    Vintage:Unknown

    Description

    Dielectric CMP

    Configuration

    No Configuration

    Documents
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    OEM Model Description

    The Applied Reflexion CMP system is Applied Materials' 300mm CMP platform delivering innovation and productivity for 100nm and beyond. Based on the production-proven Applied Mirra Mesa CMP architecture, the Applied Reflexion system offers 300mm processing capabilities for oxide, STI, polysilicon, tungsten, and copper applications. Titan Head technology delivers excellent dishing and erosion performance with better repeatability. The system's FullScan endpoint system enables superior process results by scanning the entire wafer. Applied Reflexion's cleaner offers a two-stage brush scrub with single-wafer megasonics in vertical orientation to minimize footprint. Its space efficient design also features factory automation and advanced process control with integrated film thickness metrology and particle monitoring options, as well as a dual wafer robot which increases tool throughput for thin films.

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