Used APPLIED MATERIALS (AMAT) REFLEXION for Sale

Description

No description

Configuration

Application: Oxide Wafer Shape: Notch CMP System: System Information Selected Option Application OXIDE System Dry In / Dry Out Process Type ALL Device Type LOGIC Device Geometry 0.18 Microns Cleaner Type DESICA Robot Type Kawasaki Wet Robot Megasonics YES System Skins Clear Skins Performance Enhancement Options Selected Option Daily PM Reduction Kit NO Consumed Process Materials Selected Option Polish Slurry Malema FM with CLC. ( Malema FM : 5ea ) FC 1 ea Missing Buff Slurry N/A Platen 1 Pad Platen 2 Pad Platen 3 Pad Pad Conditioner Disk N/A Pad Conditioner Head DDF3 Pad Conditioner Disk Holder Magnetic Factory Interface Options Selected Option Platen 1 ISRM N/A Platen 2 ISRM N/A Platen 3 ISRM N/A In Line Metrology NANO 9010b IAPC Yes Advanced Process Control NONE SECS GEM Interface YES Integrated System Basic FABS 300mm FI Loader port (3 Port) FI Robot Blade 300mm Kawasaki Finger Robot Blade Bar Code Reader NO Factory Automation YES Polisher Options Platen and Head Options Selected Option Polishing Head Porfiler 5 Zone Head ( 4 ea Installed ) Upper Pneumatics Assembly MKS G4+ Pad Wafer Loss Sensor Single Sensors W / Light Pipe Platen Temperature Control NO Platen Temp Control Cable NO Upper Platen Coating Teflon Coating Slurry Delivery Options Selected Option Slurry Delivery 3 Slurries & 1 DIW / PLATEN Slurry Flow Rate Malema FC ; 5ea Slurry Flow Monitor Yes & CLC Slurry Containment Bulkhead Double Containment Slurry Facilities NONE Slurry Loop Line N/A Slurry Loop Line A NO Slurry Loop Line B NO Slurry Loop Line C NO Slurry Dispense Arm Standard Slurry Leak Detector YES Clean Plumbing NO DI Water YES Facilities Options System Safety Equipment Selected Option CE Mark YES EMO Guard Ring YES EMO IO NO System Labels English System User Labels English LOTO Box NONE Smoke Detector YES Polisher Slurry Leak Sensor YES Electrical Requirements Selected Option Line Frequency 50/60 HZ Line Voltage 200-208 VAC Uninterruptible Power Supply NONE Delta Connection YES Power Lamp Green Lamp Power Connected Lamp YES Circuit Breaker Polisher : 150A, Cleaner : 30A AC Outlet Box YES GFI Type STANDARD 30mA Isolation Transformer Not Applicable Isolation Transformer for DESICA NO Umbilicals Selected Option Polisher to Controller Cable YES Controller to Monitor Cable YES NANO Controller to Mirra Cable YES Slurry System Interface Cable N/A Factory Hookup Upper Exhaust N/A Upper Exhaust Material N/A Lower Exhaust YES Exhaust Vent Interlock N/A Upper Exhaust Connection N/A Drain Manifold Single Line Drain Adapter NPT Fittings Elbow Fitting For Drain Pan NO Castors for Mirra System NO Weight Distribution Plate NO DIW Inlet Assembly W / O CDA Regulator Internal Vacuum Venturi YES Operator Interface Options User Interface Selected Option Monitor Selection 2 Monitor Monitor 1 Location FI Unit Front Monitor Missing Monitor 2 Location FPD ON CART Class 1 Cart for 1 Monitor 0 Class 1 Cart for 2 Monitors 0 Class 100 Cart for 2 Monitors 0 Stainless Steel Cart 0 Mouse or Trackball Mouse Printer NONE CPU VME B/D GE VMIVME 7645 (1.6GHz, 512Mb) Hard Disk Backup NO Start Stop Button STD Light Towers Selection 2 Light Towers : Polisher, FI Unit Polisher Unit Missing Controller Light Tower Selected Option Controller Tower Mounting Type N/A Controller Tower No of Colors N/A Controller Tower Lamp Type N/A Controller Colors Sequence N/A FABS Light Tower Selected Option FABS Tower Mounting Type Vertical Flush Mounted FABS Tower No of Colors 3 Color FABS Tower Lamp Type Incandescent FABS Tower Colors Sequence RYG Cleaner Options Cleaner Options Selected Option Mesa Cleaner YES JMF Wafer Handling Kit Not Applicable Megasonics Module Selected Option Delivery Tank Megasonics Megasonics Delivery Type Direct Chemical A Chemical B Brush Module Selected Option Brush 1 Delivery Type Direct Type Brush 1 Chemical HF Brush 2 Delivery Type Direct Type Brush 2 Chemical SC-1 Dry Module Selected Option Dry Type IPA Dry IPA Tank Yes Upper Electronics Selected Option Upper Electronics PV2 16 Axis Driver

OEM Model Description

The Applied Reflexion CMP system is Applied Materials' 300mm CMP platform delivering innovation and productivity for 100nm and beyond. Based on the production-proven Applied Mirra Mesa CMP architecture, the Applied Reflexion system offers 300mm processing capabilities for oxide, STI, polysilicon, tungsten, and copper applications. Titan Head technology delivers excellent dishing and erosion performance with better repeatability. The system's FullScan endpoint system enables superior process results by scanning the entire wafer. Applied Reflexion's cleaner offers a two-stage brush scrub with single-wafer megasonics in vertical orientation to minimize footprint. Its space efficient design also features factory automation and advanced process control with integrated film thickness metrology and particle monitoring options, as well as a dual wafer robot which increases tool throughput for thin films.