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APPLIED MATERIALS (AMAT) MIRRA
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    Key Item Details

    Condition:Used

    Operational Status:

    Product ID:30725

    Wafer Sizes:8"/200mm

    Vintage:2001

    Description

    No description available

    Configuration

    Titan Heads

    Documents
    OEM Model Description

    The Mirra® is a state-of-the-art CMP system that offers a flexible platform for process development and efficient manufacturing. Its unique four-head/three-platen design and advanced features such as the Titan Head™ wafer polishing carrier and the In-situ Rate Monitor™ (ISRM™) offer superior process control and flexibility while enabling system throughput of more than 50 wafers per hour. The Titan Head delivers consistent world-class within-wafer uniformity and repeatability with minimum edge exclusion over a wide range of process conditions. The ISRM detects film thickness changes during polishing, for highly accurate, real-time process control that allows the user to precisely define material removal and thus, process endpoint. The Mirra system is the answer for the full range of emerging CMP requirements, including compatibility with different cleaning systems and factory-automated buffering.

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