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ACCRETECH / TSK UF3000
    Description
    Asset HSS: Not Available. Tool is operating in a clean room. Hard disk drive will be removed from tool.
    Configuration
    Overall accuracy : within 4µm Stage positioning accuracy: 2µm / cp300mm Low noise chuck Mini-Environment *Option Connected with an Agilent 4073A Tester. Temperature range: 15°C"-'150°C Configured for AmbienVHot temperatures. To operate up to 150°C. No Chiller equipped. Chuck Type: Low Noise Chuck. Chuck MFG: NOV-13 Tester Interface: Connected on GP-IB between Prober and Tester. Tool corresponds with Tester on GP-IB. Camera: Cognex Insight 17 42. No missing or damaged parts.
    OEM Model Description
    The UF3000 is a fully automatic, ultra-high function probing machine developed by ACCRETECH / TSK to be the de facto standard model for the semiconductor testing process. It meets a wide range of customer requirements, including high-mix low-volume production for System LSI and mass production for memories. The machine has received high evaluation from major device manufacturers in terms of CoO (Cost of Ownership) and OEE (Overall Equipment Efficiency).
    Documents

    No documents

    ACCRETECH / TSK

    UF3000

    verified-listing-icon

    Verified

    CATEGORY

    Probers
    Last Verified: Over 60 days ago
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    27520


    Wafer Sizes:

    12"/300mm


    Vintage:

    2013

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
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    ACCRETECH / TSK UF3000
    ACCRETECH / TSKUF3000Probers
    Vintage: 0Condition: Used
    Last Verified3 days ago

    ACCRETECH / TSK

    UF3000

    verified-listing-icon

    Verified

    CATEGORY

    Probers
    Last Verified: Over 60 days ago
    listing-photo-1cefe95bcbf64a73ac4270bfb08c5dff-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/42468/1cefe95bcbf64a73ac4270bfb08c5dff/9f28b80b06584dcb9b8641697cd065f1_e86e2cb7abf146c6b181170cf9eb9eaf1201a_f.jpeg
    listing-photo-1cefe95bcbf64a73ac4270bfb08c5dff-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/42468/1cefe95bcbf64a73ac4270bfb08c5dff/6999929ac5484097a91c03162a16ca82_d71c97add685417a9513b2dc81cd0e0e1201a_f.jpeg
    listing-photo-1cefe95bcbf64a73ac4270bfb08c5dff-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/42468/1cefe95bcbf64a73ac4270bfb08c5dff/0619dd5f84364bfdae9675983eefb152_ac5bd74f20e941bda440060608dd83a21201a_f.jpeg
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    listing-photo-1cefe95bcbf64a73ac4270bfb08c5dff-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/42468/1cefe95bcbf64a73ac4270bfb08c5dff/7917ae2b09c842faaf41cd0fcc81cd6e_8b0dda259ffc409dab49a6d8b8599c15_f.jpeg
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    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    27520


    Wafer Sizes:

    12"/300mm


    Vintage:

    2013


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Asset HSS: Not Available. Tool is operating in a clean room. Hard disk drive will be removed from tool.
    Configuration
    Overall accuracy : within 4µm Stage positioning accuracy: 2µm / cp300mm Low noise chuck Mini-Environment *Option Connected with an Agilent 4073A Tester. Temperature range: 15°C"-'150°C Configured for AmbienVHot temperatures. To operate up to 150°C. No Chiller equipped. Chuck Type: Low Noise Chuck. Chuck MFG: NOV-13 Tester Interface: Connected on GP-IB between Prober and Tester. Tool corresponds with Tester on GP-IB. Camera: Cognex Insight 17 42. No missing or damaged parts.
    OEM Model Description
    The UF3000 is a fully automatic, ultra-high function probing machine developed by ACCRETECH / TSK to be the de facto standard model for the semiconductor testing process. It meets a wide range of customer requirements, including high-mix low-volume production for System LSI and mass production for memories. The machine has received high evaluation from major device manufacturers in terms of CoO (Cost of Ownership) and OEE (Overall Equipment Efficiency).
    Documents

    No documents

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