Description
No descriptionConfiguration
- Fully automatic - Auto aligning wafer notch - Auto wafer loading and unloading - Dual spindle - 4 universal porous chuck table in 1 turntable - 1 polishing table - H1 wafer handling pad - LCD touch screen GUI - Machine door with interlock Wafer back grind tap remover & wafer mounter - Wafer mount table - Peeling table - Roller mount - Adhesive peeling functionOEM Model Description
Grinder + CMP stress release High through put wafer handling 15umt wafer thickness in mass producing. The RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. All the processes are completed without moving the wafer on the same chuck table.Documents
No documents
ACCRETECH / TSK
PG300RM
Verified
CATEGORY
Polishing and Grinding
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
56213
Wafer Sizes:
8"/200mm, 12"/300mm
Vintage:
2007
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ACCRETECH / TSK
PG300RM
Verified
CATEGORY
Polishing and Grinding
Last Verified: 28 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
56213
Wafer Sizes:
8"/200mm, 12"/300mm
Vintage:
2007
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
- Fully automatic - Auto aligning wafer notch - Auto wafer loading and unloading - Dual spindle - 4 universal porous chuck table in 1 turntable - 1 polishing table - H1 wafer handling pad - LCD touch screen GUI - Machine door with interlock Wafer back grind tap remover & wafer mounter - Wafer mount table - Peeling table - Roller mount - Adhesive peeling functionOEM Model Description
Grinder + CMP stress release High through put wafer handling 15umt wafer thickness in mass producing. The RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. All the processes are completed without moving the wafer on the same chuck table.Documents
No documents
Similar Listings
View AllACCRETECH / TSK
PG300RM
Polishing and GrindingVintage: 0Condition: UsedLast Verified: Over 60 days agoACCRETECH / TSK
PG300RM
Polishing and GrindingVintage: 2007Condition: UsedLast Verified: Over 60 days agoACCRETECH / TSK