 6DS-SP CMP system, a game-changer for high-volume production environments that crave efficiency and precision. Armed with two wafer carriers and dual tables, this system effortlessly accommodates wafer sizes ranging from 100mm to 200mm. A standout feature is its sophisticated motor current endpoint, providing real-time feedback for unprecedented accuracy and control. The innovative multi-zoned ViPRR carriers contribute to its superiority, enhancing wafer handling and boosting process consistency. Where this system truly shines is in its performance capabilities. For 200mm Oxide CMP, it boasts an impressive WIW Uniformity of less than 5% 1 sigma, and a minimal edge exclusion of just 3mm, ensuring a meticulous yield. The 6DS-SP is not merely limited to Oxide applications but extends its prowess to W, AITiC, SOI, and PolySi domains, offering unparalleled flexibility. Equip your production line with the 6DS-SP CMP system, where advanced technology meets unmatched versatility.

STRASBAUGH

6DS-SP

7AA-II

"Advanced nTellect Wafer Grinder, 7AF, renowned for reducing sub-surface damage and improving surface finish with repeatable thickness control. The nTellect Grinder boasts high volume wafer throughput at a low cost, utilizing innovative technologies such as tapeless backgrinding, in-feed technology, in-situ thickness control, force adaptive grinding, linear traversing grind spindles, automated process control, and thin wafer handling. Serving a wide array of applications including integrated circuit backgrinding, silicon on insulator, prime wafers, gallium arsenide, lithium niobate, aluminum titanium carbide for read/write heads, glass, sapphire, and quartz, the nTellect Grinder relies on near-frictionless, force-sensitive infeed mechanics and an intelligent control system, which together increase wafer strength and reduce breakage. Its ultra-stiff air bearing spindles and sub-micron feed rates deliver superior surface finishes. The Grinder also features in-situ digital measurement probes and unique linear traversing grind spindles for optimized throughput and accurate, consistent wafer thicknesses. Lastly, with the addition of Tapeless Backgrinding and ultra-fine grit grind wheels, nTellect is poised to revolutionize thin wafer applications.
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STRASBAUGH

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