Description
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Sharp Precision SP-112 Hybrid Package Cover Remover. Designed to efficiently remove seam welded covers from flat (butterfly) or plug-in type microelectronics packages up to 3 in. x 3 in. in a manner which allows rewelding of a new cover without the need for further package surface finishing. 115V, 60 Hz, 10A. No longer made.OEM Model Description
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SOLVISION
PRECIS 3D
Verified
CATEGORY
Metrology
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
17926
Wafer Sizes:
Unknown
Vintage:
Unknown
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View AllSOLVISION
PRECIS 3D
Verified
CATEGORY
Metrology
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
17926
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Sharp Precision SP-112 Hybrid Package Cover Remover. Designed to efficiently remove seam welded covers from flat (butterfly) or plug-in type microelectronics packages up to 3 in. x 3 in. in a manner which allows rewelding of a new cover without the need for further package surface finishing. 115V, 60 Hz, 10A. No longer made.OEM Model Description
None ProvidedDocuments
No documents