KLA-Tencor Corporation announced it has completed its acquisition of Therma-Wave Corporation.
Therma-Wave develops, manufactures, and sells process control metrology systems used in the manufacture of semiconductors.

The Therma-Wave Opti-Probe 2600 is a metrology system that supports Beam Profile Reflectometry (BPR) and Beam Profile Ellipsometry (BPE) modes. A 675 nm thermoelectrically cooled diode laser is used to establish the optical parameter and in spectrometry mode, a visible 450 to 840 nm tungsten halogen lamp is used. The system integrates BPR, BPE, and Spectrometry to further expand its measurement capabilities.

KLA / THERMA-WAVE

OP-2600

The Therma-Probe model TP420 is a high stability automated ion implant process control system that uses a laser-based, noncontact, nondestructive measurement technique for monitoring ion implantation and other processes. It can measure implants with doses from 1x10E11 to 1x10E15 ions/cm2 and energies from 5 keV to 3 MeV. The system is capable of handling SEMI standard 100 to 200 mm wafers.

TP-420

The TP-500 is a Therma-Probe product that uses a laser-based, nondestructive measurement technique for monitoring ion implantation. It provides improved product reliability by employing the modernized and field-proven platform of the Therma-Wave Opti-Probe 2600, and added pattern recognition and improved wafer throughput.

TP-500

The Opti-Probe 5240 is a tool designed to meet thin film metrology requirements. It offers full spectrum Spectroscopic Ellipsometry to directly measure optical constants, Absolute Ellipsometry to accurately characterize your thinnest films.

OP-5240

TP-400XP

TP-320

OP-2600 DUV has integrated deep ultra-violet reflectance, or DUV, with the existing system to expand measurement range.

OP-2600 DUV

**PARTS**

Therma-Probe product:
Added cassette-to-cassette wafer handling and automation software to the capability of the TP-200 to satisfy industry need to proliferate product wafer measurements.

TP-300

TP-420XP

Therma-Wave TP-630XP has increased the repeatability of ion implantation dose measurement by a factor of four and released the application for ultra-shallow junction depth metrology.

TP-630XP

TP-5011

The Opti-Probe 3290 is a thin film measurement system that uses Beam Profile Reflectrometry (BPR) for thick dielectric films greater than 500A and Beam Profile Ellipsometry (BPE) for thin dielectric films less than 500A. It has a thermo electrically cooled diode laser with a wavelength of 675 nm and a tungsten halogen lamp for spectrometry mode with a range of 450 to 840 nm. The system can measure film thickness, index of refraction, extinction coefficient, and reflectivity for multiple layers and multiple parameters. It also provides automated defect review, enabling rapid correction of defects for improved quality.

OP-3290

The Opti-Probe 7341 is a thin-film and critical dimension (CD) metrology tool that is part of Therma-Wave’s Opti-Probe line of thin-film measurement tools. It delivers a metrology solution for high-volume 65nm chip production to semiconductor manufacturers, yielding better precision and productivity than earlier generation tools. Comprehensive field data for the Opti-Probe-7341 demonstrates an improvement in performance for its customers’ most critical thin-film and optical CD applications by a factor of up to two times.

OP-7341

OP-2690

The Opti-Probe 3260 (OP-3260) is a metrology tool developed by Therma-Wave that offers a 30% increase in productivity. It has the same thick and thin film measurement capabilities as the original Opti-Probe, making it the only choice for measuring TiN t, n, and k in the UV range down to 190nm. The OP-3260 also features better robotics, Pentium-speed processing, a spectrometric light source that can be changed in 15 minutes without optics recalibration, and the surest pattern recognition in the business. These improvements result in a significant jump in productivity, making it easier to turn out more wafers.

OP-3260

The OP-5220 is part of the Opti-Probe Thin and Thick Film Measurement System, specifically the OP-5200 Series. This series integrates up to five measurement technologies, including BPR (Back Pressure Regulator), BPE (Bipolar Electrode), DUV (Deep Ultraviolet) reflectance, Spectroscopic Ellipsometry, and AE (Absolute Ellipsometry). This integration allows for comprehensive and accurate measurement of various physical properties of thin and thick films.

OP-5220

OP-3290 DUVi

The Therma-Wave TP-XP Series is designed to provide high measurement precision for critical threshold voltage (Vt) implants as well as post-anneal monitoring of ultra-shallow junctions for source-drain extensions. The tool incorporates advancements in lasers, optics, and wafer stage technology to respond to advanced metrology needs and supports SECS protocol and I300I automation industry standards requirements. With a large installed base, including all major IC manufacturers, and award-winning customer support, the Therma-Probe® XP series is a solution for 90 nm and beyond.

TP-500XP

Integrated OP-3260 system with DUV reflectance.

OP-3260 DUV

The Opti-Probe 3290 DUV is a metrology tool used for measuring TiN t, n, and k in the UV range down to 190 nm.

OP-3290 DUV

The THERMAWAVE OP 5340 metrology system is used for complex thin film thickness measurement on 150mm, 200mm, and 300mm wafers. The THERMAWAVE OP 5340 has 65nm IC Production Accuracy. The THERMAWAVE OP 5340 is capable of directly interfacing with automated material handling systems.
OP-5300 Series has expanded OP-5200 series wafer measurement capability to 300 millimeters.

OP-5340

Integrated BPR with a newly patented optical technology, BPE, to enhance measurement capabilities for very thin-films.

OP-2000

OP-5300 Series has expanded OP-5200 series wafer measurement capability to 300 millimeters.

OP-5340C

Measurement system. Spectrometer detector. Series-7, a new universal 200/300mm platform, builds on the OP-5000 technologies. Delivering higher productivity and enhanced optics to address advanced thin-film applications, it improves upon industry requirements for on-product wafer measurement resulting in lower COO and extendibility to the customer.

OP-7340

Introduced first non-destructive process control metrology system to measure ion implantation. Solved wide-spread IC industry need for rapid ion implant metrology on product wafers.

TP-200

Therma-Probe product:
Significantly improved repeatability of the basic ion implantation dose measurement and added second wafer cassette station for improved tool calibration.

TP-400

The OP-5230 is part of the Opti-Probe Thin and Thick Film Measurement System, specifically the OP-5200 Series. This series integrates up to five measurement technologies, including BPR (Back Pressure Regulator), BPE (Bipolar Electrode), DUV (Deep Ultraviolet) reflectance, Spectroscopic Ellipsometry, and AE (Absolute Ellipsometry). This integration allows for comprehensive and accurate measurement of various physical properties of thin and thick films.

OP 5230

OP-5341

Series-7 is a universal 200/300mm platform that builds on the OP-5000 technologies. It delivers higher productivity and enhanced optics to address advanced thin-film applications. It improves upon industry requirements for on-product wafer measurement resulting in lower COO and extendibility to the customer.

OP-7000

The Therma-Probe® 680XP ion implant/anneal metrology system enables inline dose monitoring for the 2Xnm/1Xnm design nodes. The Therma-Probe 680XP produces critical process information about ion implant dose and profile, implant and anneal uniformity and end of range damage. In addition, the Therma-Probe 680XP system’s high resolution micro uniformity maps provide fingerprinting capability for implant and anneal process development.

TP-680XP

Introduced a new, patented optical technology, BPR®, to measure thin-film deposition and removal.

OP-1000

The Opti-Probe 7341XP is a thin-film and critical dimension (CD) metrology tool developed by Therma-Wave. It is an extension of their widely deployed Opti-Probe line of thin-film measurement tools and delivers a metrology solution for high-volume 65nm chip production that yields better precision and productivity than earlier generation Opti-Probes. The tool has demonstrated an improvement in performance for its customers’ most critical thin-film and optical CD applications by a factor of up to two times. It leverages Therma-Wave’s field-proven Series-7 Opti-Probe platform, which combines five distinct film measurement technologies needed to meet the increasingly complex demands of process control. 

OP-7341XP

The Therma-Wave TP-630 possesses state-of-the-art ion implant measurement technology for wafer sizes up to 300 millimeters. It has expanded wafer measurement capability to handle the new 300 millimeter silicon wafers, in addition to traditional 200 millimeter wafers.

KLA / THERMA-WAVE

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