Kulicke & Soffa is a leading provider of semiconductor, LED and electronic assembly solutions serving the global automotive, consumer, communications, computing and industrial markets.

KULICKE & SOFFA (K&S)

POWERFUSION

Wafer level bumping for area array applications.

WaferPRO Plus

IBOND 5000

Advanced packaging, high performance and productivity die attach bonder for single or stack die bonding.

APAMA DA

8028 PLUS

The K&S iX has continuous enhancements in the total pick and place process, further introducing a new light weight feeding range with proven high field-measured pick-rates of over 99.99%, higher placement accuracies for passives (35 microns), new component range, 25% increased output for camera-aligned components. With software optimizing factory processes efficiently, the iX 302 and iX 502 simply blends into your factory. The truly modular single sided concept simplifies use and offers complete control and overview from one side in a volume environment.


iX 502

Model 6900, an automatic multi-process assembly system which can be configured to support either conventional die bonding applications or alternate semiconductor assembly technologies. 

6900

DEDICATED WEDGE BONDER FOR SINGLE-ROW TO PACKAGE. Power-C Wedge Bonder is built specifically for single-row TO package power devices. These bonders are driven by proven and powerful direct-drive motion systems, bondheads, ultrasonic generator systems and wire feeding mechanisms, that are on the PowerFusion and Asterion platforms. In addition, expanded pattern recognition capabilities deliver industry leading productivity and reliability. 

POWER-C

The ConnXPS LED PLUS is faster and now has a larger bondable area, with 80mm width as standard, with an optional kit to upgrade to 87mm with the ConnX LED PLUS LA.

ConnX LED PLUS LA

Ball bonder, advanced wafer level bonding applications.

AT PREMIER PLUS

8028S

4122

Lithographic stepper for the formation of redistribution layer ("RDL") in FOWLP, fan-in wafer level packaging ("FIWLP") and flip chip ("FC").

LITEQ 500A

Chip and IC shooting from 0402M (01005) to 45 x 45 x 21 mm at 24,300 cph (IPC9850(A))

iFlex T2

RAPID ELA

984-14

ELITE

AB356 IL08

Ball bonder, large area substrate and matrix applications for copper wire.

IConn ProCu LA

The Model 8070, a bonder designed  specifically  for the assembly of micro-BGA.

8070

Advanced packaging, lithographic stepper for the formation of RDL in FOWLP, FIWLP and FC with higher throughput.

LITEQ 500B

Ball bonder, large area substrate and matrix applications.

IConn PLUS LA

AUTOMATIC HIGH SPEED WIRE BONDER. ConnX ELITE Opto is the latest high speed automatic wire bonder in the industry leading Power Series. Updated motion control systems and the Quick-LED Suite processes deliver maximum productivity and simplified process optimization. ConnX ELITE Opto is the new standard in interconnection for LED packages.

ConnX ELITE Opto

8028 WG

HIGH PERFORMANCE WAFER LEVEL DIE ATTACH. With an emerging trend in attaching thinner die and substrates, the iStack W+ offers a solution for wafer level die attach.

iSTACK W+

4206

PowerFusion HLx can handle extra-wide matrix and IPM leadframes up to 105 mm wide. The HLx Model has all the capabilities of the HL Model with the added benefit of handling leadframes up to 105 mm wide. Whether you have a current requirement for wide leadframe processing or just want to invest in a flexible platform for future leadframe development, the HLx Model is the best choice for many applications.

PowerFusion HLx

TAB is an alternate assembly method which uses a  thin, flexible film of laminated copper and polyamide in place of a conventional package.  In a TAB assembled device, the die is bonded directly to copper leads, thereby eliminating the need for wire bonding.  The Company's principal TAB bonder is the Model SP2100.

SP2100

The PowerRibbon is a leading-edge interconnect for power packages, and is continuing to gain market acceptance. Further extension of our PowerRibbon® range towards both larger and smaller sizes.

PowerRibbon

1488XQ

1484XQ PLUS

984-6 PLUS

ConnX LA

ConnX VLED

8028L PPS

End-of-line placer placing up to 120 x 52 x 25 mm at 7,500 cph (IPC9850(A))

iFlex H1

Wedge bonder, smaller power packages using either aluminum wire or PowerRibbon.

PowerFusion HL

Chip and IC shooting from 0402M (01005) to 17.5 x 17.5 x 15 mm at 51,000 cph (IPC9850(A))

iFlex T4

HIGH PERFORMANCE & HIGH PRODUCTIVITY DIE ATTACH. The iStack S+ is designed for high-end epoxy and film die attach applications with process flexibility to support both the memory and image applications. Its enhanced process features include the face-down process, In-Situ UV and bond force detection mechanism, delivering productivity improvement and performance.

iSTACK S+

ADVANCED DISPLAY (DIE TRANSFER). Configurable for sorting, mixing, re-pitching, die bonding, or mass transfer. Position Correction Mode (PCM): 100Hz at accuracy of 10μm 3σ. Multi Pattern Placement (MPP): Multiples of 100Hz. Scan Mode: 10,000Hz for mini LED


LUMINEX

Ball bonder, extended large area substrate and matrix applications for copper wire.

IConn ProCu PLUS ELA

Automatic wire bonder designed for low lead applications, a segment of the market we had not previously targeted.

Nu-Tek

8068

1488 TURBO+

ConnX LED PLUS

4127

ConnX ELITE Opto LA

UV-950

"""High productivity bonder for low-to-medium pin count applications.""
ConnX Plus is a second generation ball bonder under the successful Power SeriesTM. When compared to the previous generation, the ConnX Plus further increases net productivity in low pin count, discrete and cost performance markets.In addition to features of the prior generation ConnXPSTM wire bonder, the ConnX Plus includes exciting new enhancements to help further increase efficiency and net productivity:
Interactive Programmable Look Ahead Vision to ease first time set-up
Power Series Xpress Loop to help increase the productivity of short wire applications
Allows the integration of the optional Dual Mag Optics Kit to support stacked die applications in discrete and low pin count devices
Field upgradable to the ConnX Plus LAPSTM in order to support an 87mm bondable area
10% higher UPH (Units Per Hour) over the first generation ConnX ball bonder."""

ConnX PLUS

Spheron, a wafer level package technology that expands the capability and performance of our wafer level package product.

SPHERON

ConnX ELITE ELA

Ball bonder, extended large area substrate and matrix applications.

IConn PLUS ELA

982-6 PLUS

The Models 1484XQ and 1484LXQ automatic gold ball wire bonders.

1484XQ

Ball bonder, cost performance extended large area substrate and matrix applications.

ConnX PLUS ELA

K&S GEN-S SERIES AUTOMATIC WIRE BONDER. RAPID MEM introduces advanced process capabilities, real-time monitoring and diagnostics to ensure the best quality and efficient assembly serving high-performance and high-reliability semiconductor applications.

RAPID MEM

Wedge bonder, power semiconductors using either aluminum wire or PowerRibbon

PowerFusion TL

ConnX ELITE Opto ELA (Extended Large Area)

ConnX ELITE Opto ELA

DuraPlus

UltraCSP

SpeedTip

7100 ADHM

ADVANCED PACKAGING (FLIP-CHIP). HIGHEST ACCURACY, HIGHEST UPH FLIP-CHIP PERFORMANCE. Kulicke & Soffa's Katalyst delivers the industry's highest accuracy and speed for flip-chip placement.  Its hardware and technology enable < 3 μm accuracy on substrate or wafer, achieving the best Cost-of-Ownership in the industry. Best-in-industry flip-chip at 15K UPH Sprint with 3 μm accuracy. Ease-of-use Automated Recipe with fully guided Setup Wizards. Automated , UPH neutral Accuracy Calibration, to avoid nozzle-to-nozzle variations during runtime. Automated thermal Drift Compensation

KATALYST

5408

Advanced packaging, thermo-compression for chip-to-wafer, high accuracy flip chip ("HA FC") and high density fan-out wafer level packaging ("HD FOWLP") bonding applications.

APAMA C2W

The Hybrid combines high-accuracy Flip Chip bonding directly from wafer with ultra-high-speed chip shooting.

HYBRID FC/DA

The K&S Hybrid is the first hybrid Flip Chip/passive placement machine with the speed and accuracy needed for cost-effective SiP manufacture.

HYBRID SIP

XENON

8098 PPS

Ball bonders, cost performance large area substrate and matrix applications.

ConnX PLUS LA

AUTOMATIC HIGH SPEED WIRE BONDER. ConnX ELITE is the latest high speed automatic wire bonder in the industry leading Power Series. Updated motion control systems and the Quick Suite processes deliver maximum productivity and simplified process optimization. ConnX ELITE is the new standard in interconnection for Discrete and Low Pin Count packages.

ConnX ELITE

The K&S iX has continuous enhancements in the total pick and place process, further introducing a new light weight feeding range with proven high field-measured pick-rates of over 99.99%, higher placement accuracies for passives (35 microns), new component range, 25% increased output for camera-aligned components. With software optimizing factory processes efficiently, the iX 302 and iX 502 simply blends into your factory. The truly modular single sided concept simplifies use and offers complete control and overview from one side in a volume environment.

iX 302

8028 SG

The Model 960 mounting stations family from Kulicke & Soffa offers a host of standard features for mounting either up to 6" wafers (960-6) or 6" and 8" wafers (960-8).

960-8

Triton RDA a wedge bonder designed for ribbon bonding.

TRITON RDA

"The Maxµm ultra performs 10% faster than its predecessor, the industry-leading Maxµm plus™.
The Maxµm ultra incorporates many technological advancements, making it the premier choice for today's complex packaging applications. A new bond force control system with piezo sensor technology allows for increased bond head velocity without increasing tool impact force. A new microprocessor control system provides for faster processing power as well as PC-style USB functionality for easier software and data handling. An enhanced wire feed/tensioning system reduces friction on the wire feed path for looping consistency at higher speeds.
Bond Force Control System with Piezo Sensor Technology
Advanced Low Friction Wire Feed System
Fully Programmable BITS System
Latest PC-based Processing Power
Small Ball Detection
Maxµm ultra Enhanced Performance
UPH +10% over the Maxµm plus
±2.5µm Accuracy for 35µm Pitch Production
Copper Wire Bonding Capable

Maxµm Ultra

The ps(Power Series) IConnPS ball bonder, which replaced the Maxum Ultra ball bonder and improves IC inter-connect performance with expanded technology that addresses advanced packaging requirements, copper wire bonding, and ultra fine pitch capability.

IConn

The industry-leading performance of the award-winning Maxµm™ high speed ball bonder is taken to an even higher level with the introduction of the new Maxµmplus. Users who want greater throughput and finer pitch capability can expect:
 UPH 10% greater than the Maxµm on most applications
 + 2.5 µm accuracy at 3 sigma
 35 µm ultra-fine-pitch process capability
This yield-enhancing accessory consists of the following...
 Innovative Moving EFO Wand Technology
 Electronic Flame-Off from directly below the wire axis
 Specially designed, Fine-tipped EFO Wand and 8X Mag Optics
...resulting in these benefits:
 Improved Free Air Ball and Bonded Ball Concentricity
 Reduced "Small Ball" occurrence
 Better intermetalic coverage and higher bond strength
 Greater yield for ultra-fine-pitch processes 
A reduced-friction wire feed path for wire down to 15 µm diameter and more efficient X-Y table motion help reduce wire cycle times to 63.0 msec. Advanced teaching and calibration software improve overall accuracy to ± 2.5 µm. This combination allows ultra-fine-pitch bonding of devices at speeds that are as much as 10% faster than the Maxµm — already the industry benchmark for accuracy and throughput.

Maxµm Plus

K&S GEN-S SERIES AUTOMATIC WIRE BONDER. RAPID introduces advanced process capabilities, real-time monitoring and diagnostics to ensure the best quality and efficient assembly serving high-performance and high-reliability semiconductor applications.

RAPID

IConn MEM PLUS ELA

8060

Fully automatic wire bonder. 
± 2.0 μm accuracy. High performance X-Y-Z motion control system. Dual-frequency transducer allows two selectable frequencies for each bond. Power Series Advanced Loops for tight control of the last kink height. On-board process optimization tools. 1pF Auto-BITS self-teach and optimization. WAVI (Wide Angle Vertical Illumination) system with programmable red and blue lighting. Optional programmable focus with a full 2.5 mm focus range. Optional copper wire bonding kit

IConn PLUS

The Model 8028 ball bonder and began to shift production capacity from the Model 8020 ball bonder.

8028

The Maxum Elite to supersede the Nutek it provides approximately a 10% productivity improvement over its predecessor and offers various other performance improvements.

Maxµm Elite

4123

 ConnX-LEDPSTM automatic ball bonder—an extension of the company’s leading ConnXPSTM bonding platform. With new features and enhancements specifically designed for LED applications, ConnX-LED will help K&S customers increase their efficiency and productivity, and meet the challenges of the fast-paced, high growth LED market.

ConnX-LED offers all of the features required for bonding LED packages, including accuracy to +/- 3.5 μm, automatic recovery paths for common production stoppages, programmable back-up power and many others—providing customers with reduced cost of ownership in a highly competitive market space

ConnX LED

8028 PPS

1488 PLUS

4124

MAXUM	

Advanced stack die and ball grid array applications.

iSTACK

ConnXPS ball bonder replaced our Maxum Elite ball bonder. The ConnXPS is engineered to provide optimal manufacturing capabilities for the lower pin count IC market and the rapidly growing LED market.

KULICKE & SOFFA (K&S)

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