Description
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Aspen 2 ICP Dual chamber system RFPP RF-10S power generator X 4 RF matching box X 4 Ebara dry pumps : AA100 X 2, A07V X 1 GAS: O2 , N2, CF4 AC box and DC box ACX pressure controller X 2 Aspen 2 computer , include robot index PCB, Analog I/O PCBs, Digital I/O PCBs, CPU board, Hard disk /floppy disk driver. Shuttle, robot assy. arm, slit door, heater block , temperature controller, heater block, quartz tube, lift pin cylinder, throttle valves, Iso valves. No missing parts.OEM Model Description
MATTSON Aspen II is Etchers & Ashers system. the Aspen II can be used with 8” wafer size. Aspen II is based on a highly reliable and productive system design. It provides proven process capabilities and cost of ownership benefits in high volume manufacturing to chipmakers worldwide.Documents
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MATTSON
ASPEN II
Verified
CATEGORY
Plasma Etch
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
24735
Wafer Sizes:
Unknown
Vintage:
Unknown
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Logistics Support
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Transaction Insured by Moov
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Refurbishment Services
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MATTSON
ASPEN II
Verified
CATEGORY
Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
24735
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Aspen 2 ICP Dual chamber system RFPP RF-10S power generator X 4 RF matching box X 4 Ebara dry pumps : AA100 X 2, A07V X 1 GAS: O2 , N2, CF4 AC box and DC box ACX pressure controller X 2 Aspen 2 computer , include robot index PCB, Analog I/O PCBs, Digital I/O PCBs, CPU board, Hard disk /floppy disk driver. Shuttle, robot assy. arm, slit door, heater block , temperature controller, heater block, quartz tube, lift pin cylinder, throttle valves, Iso valves. No missing parts.OEM Model Description
MATTSON Aspen II is Etchers & Ashers system. the Aspen II can be used with 8” wafer size. Aspen II is based on a highly reliable and productive system design. It provides proven process capabilities and cost of ownership benefits in high volume manufacturing to chipmakers worldwide.Documents
No documents