EBARA

A70W

A150W-T

A150W-M

A10S

150 X 40

A70WN	

AA40W

A30W

AA70W

This 300mm CPM system uses EBARA’s Dry-In/ Dry-Out processing and two-head/ two platen design for maximum operation flexibility. Features include 3-step cleaning, 4 FOUP loading ports, and buff stations.

F-REX300

The Ebara FREX 300 S is a 300mm CMP system, featuring a four-head, four-platen design with a three-step clean process. It reliably meets 7nm tech requirements, providing development and production flexibility, and best-in-class reliability and cost of ownership.

F-REX300S

AA20

AAE40WN

AA200W

AA20N

Vacuum Dry Pump AA20N-H, 200V, 50/60 Hz, Corrosian Resist, Horizontal Outlet, with Exhaust Pressure Sensor

AA20N-H

AA200WN

80 X 25

40 X 20

A300W	

EBARA FREX 200 is a CMP system which is used for wafer grinding, lapping, and polishing. The FREX 200 is compatible with 200mm wafer size.

F-REX200

AA30

EPO 112

150X40 UERP6M

AA10

EPO 223

EAC300BI-T

AA10N	

305W

AA40WN

50 X 20

ET600H-US

ESA70W

AAS200WN

EPO 222

GDC 250 SA

AAS300WN

ESR20N

Vacuum Dry Pump AA20-H, 200V, 50/60 Hz, Horizontal Outlet

AA20-H

EBARA's CMP system Model F-REX is Chemical Mechanical Polishing system that enables nanometer level planarity (10~20nm on 300mm wafer) in semiconductor manufacturing process. Ebara's CMP system, Model F-REX200M2 and F-REX300X has achieved both an advanced
process performance and high productivity. This is made possible with "1-head per 1-table" unique architecture processing an individual wafer delicately while the "4 table platform" enables high throughput.

F-REX300X

A25S

AA70W-H

ET-300W	

GDS500SA	

Technical Characteristics:
-DC Motor
-Low Energy consumption
-Complete pump safeguard system
-High pump operating temperature preventing condensation
-Low noise and low vibration

AAL10

Pumping Speed: 1670 L/min
Ultimate Pressure: 5.0Pa

EV-S20P

ET-600	

AA100W

A30W-C

EPO 222T

AA70WN

UFP 300A

AA70WN-H

UERR6M 50X20 

ESA25-D

ESDP 30	

150X40UERP6M-J

CS-22

EMT2400MBWC	

ESR200WN

A07V

AA40WV1-H

Vacuum Dry Pump A07V-B, 200V, 50/60 Hz, Basic Version

A07V-B

ET1600WS

A30W N

AAS100WN

GDS250SA

The F-REX300S2 and F-REX300X3SC offers a four head, four platen with three step clean design allowing for customized process recipes with the demonstrated capability to reliably meet 7nm technology requirements. 

F-REX300SII

150X40 UERP6M-U

50X20UERR6M

EPO-222D

Dry (oil free) vacuum pumps
Pumping Speed (60 Hz): 20,000 l/min

EST200WN

ESR100WN

Pumping Speed: 1670 L/min
Ultimate Pressure: 5.0 Pa

EV-S20N

AA100W-H

**PARTS**

40X20ERD5M-NJ

EAC300bi-hv

ET300WS	

ESR80WN

EBARA's F-REX CMP system offers nanometer-level planarity (10~20nm on 300mm wafer) in semiconductor manufacturing. Models F-REX200M2 and F-REX300X achieve advanced process performance and high productivity. The unique "1-head per 1-table" architecture delicately processes individual wafers, while the "4 table platform" ensures high throughput.

F-REX200M2

40×20 ERD5M-N

The ESA70W dry vacuum pump by Ebara is designed for light-gas applications like MOCVD. It offers options like dual voltage, alternate exhaust configurations, NiResist cast material, idle mode, seismic brackets, integrated rack solutions, installation lifts, and reusable shipping crates. It's perfect for medium to light-duty processes, hydrogen handling, large load-lock applications, and as a replacement for the A Series EBARA Model A70W pump.

EBARA

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